Industry Directory | Distributor
Custom-Fasteners.com specializes in manufacturing hard to find micro screws to specification, supplying OEMs and manufacturers worldwide.
Industry Directory | Manufacturer
Supplier of High-Tech Low-Cost Printed Circuit Boards with 1-48 layers from 24h express. Flex, flex-rigid, metal core, impedance control, blind & buried vias as well as SMD Stencils.
New Equipment | Board Handling - Storage
Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T
New Equipment | Assembly Services
Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota
Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob
80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.
Electronics Forum | Fri Oct 03 01:01:09 EDT 2008 | khushi
Dear All, I would like to know that what are the problems which will be encountered while mounting 01005 components & BGA's on the PCB for thickness 0.2mm and what will be the processes involved in mounting the components.
Used SMT Equipment | Pick and Place/Feeders
Model :KE-2070 Placement speed：Chips:16, 000CPH(0.225sec/chip) Ics:4,600CPH(0.7sec/IC) Component mount range:0.4x0.2mm~□33.5mm Station:80 Power supply:3P/200~415V/3KVA Size:1,400x1, 393x1, 455mm Weight:1,530kg
Used SMT Equipment | Pick and Place/Feeders
Model :KE-2070 Placement speed：Chips:16, 000CPH(0.225sec/chip) Ics:4,600CPH(0.7sec/IC) Component mount range:0.4x0.2mm~□33.5mm Station:80 Power supply:3P/200~415V/3KVA Size:1,400x1, 393x1, 455mm Weight:1,530kg
Industry News | 2022-12-07 07:15:12.0
The new line features BGA Rework Stations that can place components as large as 120mm and as small as 0.2mm
Parts & Supplies | Semiconductor & Solar
JUKI KE - 2080 parameters Substrate size M-type substrate (330×250mm) L-shaped substrate (410×360mm) L-wide substrate (510 x 360mm) (optional) E-type substrate (510×460mm) Mount component height 12mm / 20mm / 25
Parts & Supplies | Assembly Accessories
FUJI H24H24GH24SH24A Work head suction nozzle 2AGKNX005100 0.2mm FUJI nozzle series
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Technical Library | 2007-01-03 16:36:58.0
Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits.
Automatic SMT Splicing Machine MLJL3272W Model: MLJL3272W Equipment size: 400mm x 460mm x H950mm Working height: 900mm Equipment weight: 50KG Electric booster wheel: None, manual push and pull Applicable placement machine: applicable to any type of
Suitable for diversified glass fibre board, FR-4 board, aluminum board, etc, especially for the PCB with components on both sides. If you have any question about the machine, please feel free to contact e-mial : bella@qy-smt.com
Heller Industries Inc. | https://hellerindustries.com/parts/6625k/
6625K - Shim 6MM ID, 10MM OD, 0.2MM THK Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
| https://pcbasupplies.com/smt-equipment-hitachi/
0.6/0.4 [HV01] $ 115.00 Add to cart Hitachi 0.7 —0.4mm [HV31C] $ 165.00 Add to cart Hitachi 0.7 —0.4mm 0.4mm*0.2mm [HG31C ] $ 195.00 Add to cart Hitachi 0.7/0.4mm/0.2 [HA10
