New SMT Equipment: 0.2mm diameter (36)

Automatic solder paste printing machine

Automatic solder paste printing machine

New Equipment | Board Handling - Storage

Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T

KingFei SMT Tech

Semi automatic solder paste printer S400

Semi automatic solder paste printer S400

New Equipment | Assembly Services

Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota

KingFei SMT Tech

Electronics Forum: 0.2mm diameter (12)

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon

Maybe something like this could work?

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Industry News: 0.2mm diameter (2)

The Balver Zinn Group to Debut OT2 Solder Paste and BRILLIANT B2012 Wire at Productronica

Industry News | 2013-10-08 14:47:36.0

The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Cobar Solder Products Inc.

How To Design Cost-Effective PCBs

Industry News | 2018-10-18 11:19:07.0

How To Design Cost-Effective PCBs

Flason Electronic Co.,limited

Technical Library: 0.2mm diameter (22)

Dispensing Solder Paste Micro-Deposits to 0.2mm - A Process Solution

Technical Library | 2007-01-03 16:36:58.0

Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits.

Nordson EFD

Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour

Technical Library | 2018-09-21 10:12:53.0

Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.

National Physical Laboratory

Videos: 0.2mm diameter (2)

Icoat x3

Icoat x3

Videos

Anda Conformal Coating iCoat3 iCoat5 iCoat6 SMTVYS

SMTVYS

icoat series

icoat series

Videos

Anda Conformal Coating iCoat3 iCoat5 iCoat6 SMTVYS

SMTVYS

Express Newsletter: 0.2mm diameter (25)

Partner Websites: 0.2mm diameter (11)

PCB Libraries Forum : IPC-7251

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_ipc7251_topic1798.xml

;IPC-7351C calculation formula will be: Pad diameter = Hole size + 2*Min. annular ring(Min 0.2mm), or = Hole size * pad-to-hole-ratio, whichever is larger. But calculated result will be 

PCB Libraries, Inc.

One-stop PCB Assembly Services - Asia Pacific Circuits

| https://www.apc-pcbassembly.com/one-stop-pcb-assembly-services/

(2.9″ x 2.9″) 7 BGA Ball Pitch 1mm ~ 3mm(4mil ~ 12mil) 8 BGA Ball Diameter 0.4mm ~ 1mm(16mil ~ 40mil) 9 QFP Lead Pitch 0.38mm ~ 2.54mm(15mil ~ 100mil) 10 Package Anti-static Bubble Bag


0.2mm diameter searches for Companies, Equipment, Machines, Suppliers & Information

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