Electronics Forum | Fri Apr 06 16:36:39 EDT 2007 | mika
Ah, I almost forget (forgot?) to mention that according to the Gerber files (which is the info we send to the PCB-house) the PCB land pattern for this LGA-36 0.35mm rounded pads and the boardhouse cannot achieve this. I understand them; 0.35mm pads,
Electronics Forum | Fri Mar 30 23:35:43 EDT 2007 | mika
Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.35mm pitch 0.60mm? We use a 0.13 mm stencil thichess beacuse on the same board there is some P.I.P comps. The board dimensions is 35 x 50 mm on a pane
Electronics Forum | Tue Jul 24 17:18:56 EDT 2007 | jmelson
USD $0.35 a part? I have a guy who will do the assembly manually and inspect afterwards for less than that! Jon
Electronics Forum | Fri Apr 04 05:02:08 EST 2003 | alexyalung
Hi All, The best solution we made on our tombstone defects is component Z dimension set at pick and place machine. Usually for 0402 components Z height is pre-set by the machine at 0.5 mm, by reducing it to 0.35mm we have solve our tombstone problem
Electronics Forum | Fri Jul 18 10:04:32 EDT 2003 | jseagle
Hi all, I am looking for some recommendations on Underfill Equipment. Such as vendors, pumps, material, etc... We will be initially underfilling a 10mm x 10mm, 0.8mm pitch, 0.35mm ball uBGA on FR4 and going down in size and pitch from there. And
Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob
80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.
Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC
The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th
Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef
Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co
Electronics Forum | Fri Aug 06 03:51:06 EDT 1999 | Thomas
Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. My regular stencil manufacturer recommend the following: Thickness: 8 mils 0805 opening: Oblong 0.35 X
Electronics Forum | Thu Jan 31 09:08:27 EST 2008 | glezfl36
Since the implementation of the ROHS process in our Company with the higher temp requirements, we had observed an increase in problems related to delamination in the PCB's. Actually we are using FR408 and Gracescore materials and are changing to a Ve
