Electronics Forum: 0.35mm pitch (Page 1 of 1)

LGA Processing

Electronics Forum | Fri Mar 30 23:35:43 EDT 2007 | mika

Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.35mm pitch 0.60mm? We use a 0.13 mm stencil thichess beacuse on the same board there is some P.I.P comps. The board dimensions is 35 x 50 mm on a pane

Underfill Equipment

Electronics Forum | Fri Jul 18 10:04:32 EDT 2003 | jseagle

Hi all, I am looking for some recommendations on Underfill Equipment. Such as vendors, pumps, material, etc... We will be initially underfilling a 10mm x 10mm, 0.8mm pitch, 0.35mm ball uBGA on FR4 and going down in size and pitch from there. And

How important NSMD pads are for the QFN and similar packages?

Electronics Forum | Wed Jul 30 23:40:45 EDT 2014 | matusov

Yes, but I have seen designs where the whole row > of leads has no mask(which is also a NSMD) Apparently I might have to do just that for some parts. We have a few parts with 0.2 mm pads at 0.35 mm pitch. Our PCB shop says that they need at least

LGA36 6.5 x 3.5 mm

Electronics Forum | Thu Apr 12 22:54:06 EDT 2007 | mika

conductor on the narrowest place ~0.07mm we suggest them to go for a PCB solder pad down to 0.30mm. The Conductor width is: 0.2mm The current problem they are having now is that there will be a problem with 14V to narrow the conductor to the narrowe

LGA36 6.5 x 3.5 mm

Electronics Forum | Fri Mar 23 23:26:40 EDT 2007 | mika

Hi, We are facing a complete new package type for us in our prototype production. RoHS LGA 36 Land Grid Array with 36 so called pads instead of bumps underneath. It is totatlly flat. This component is only 6.5 x 3.5 x 1.6 mm and we recieved them in a

Re: Solder Paste Dispense problems

Electronics Forum | Thu Nov 30 21:13:55 EST 2000 | Dave F

Can't find "WS601" on the Alpha site. What is that stuff? So, with nothing to go on, I'll just guess ... Yer probably cold welding the solder particles together. The nozzle size (inside diameter) determines the dot size. * With glue, small dot si

LGA36 6.5 x 3.5 mm

Electronics Forum | Fri Apr 06 12:25:55 EDT 2007 | mika

Thanks DaveF, Ohh I still whish there was a way to share some pictures... * Pads on pcb are very very strange: It varies from a non uniform pattern but after we measure these I would say ~0.22 - 0.24mm dia. Haha, We have never discovered such a stra

0402 stencil design

Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef

You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas

0.4mm PCB Thickness - production issues

Electronics Forum | Wed Sep 13 20:04:37 EDT 2006 | mika

Hi, We have a customer that want us to produce a single sided 0.4 x 100 x 50 mm size RoHS pcba approx 1000 of them. The board only contains three 2.54mm pitch Non P.I.P, SMT-connectors. We have never produced such a thin pcb:s before. We are thinkin

Cleanliness test

Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard

Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C

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