Electronics Forum: 016 (Page 1 of 7)

Step-up stencil: recommendation thickness

Electronics Forum | Wed May 22 10:27:23 EDT 2019 | emeto

Greg, this is a huge pitch. 0.16mm is safe for this size of part.

Step-up stencil: recommendation thickness

Electronics Forum | Wed May 22 12:00:13 EDT 2019 | gregoireg

Thanks. It starts to make sense. There is a formula at the bottom of this page: http://www.circuitinsight.com/programs/50456.html It says: Stencil Thickness = 2.64mil + 0.0831 * pitch of component in mil. for 1.13mm, that gives exactly 0.16mm. So,

Moisture free storage units.

Electronics Forum | Thu Jun 19 02:28:42 EDT 2003 | Desmond Bezuidenhout

I assisted a company in the design and manufacturing of a +/- 700l cabinet utilizing a controlled nitrogen environment to purge. Any enquiry call +27 (0)16 9335747 or write to my mail.

Component Package/Classification

Electronics Forum | Wed Apr 13 21:31:36 EDT 2005 | Thaqalain

So,1005/0402 and 1608/0603 are same components except last numbers are in inches. For 0402: L=.04"*25.4=1.016mm: W=.02"*25.4=0.5mm which was for component 1005 as per JIA. Am I correct?

Vertical bend resistors solder fillet

Electronics Forum | Fri Dec 13 10:06:05 EST 2013 | davef

For vertical mounted, axial leaded components; the standoff from the land to the component body should be 0.4mm[0.016in] to 1.5mm[0.059in]. Right?

Head Driver for HSP4797

Electronics Forum | Thu Sep 05 14:44:41 EDT 2019 | jbaez1

Looking for Pack Driver or driver unit 630 119 8361 from HSP4797 (Universal, Sanyo or Hitachi): Tag information: Pack Driver Model: D2890B S ver. 0.16 W ver. 0.00 Made in Japan

Re: Micro Vias in Pads

Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen

| We have successfully put .016" vias in .030" pads. | There is no issue with .030" solder balls, since | the actual volume of the .002" via in pad is small | compared to the ball+solder paste volume. | We did notice random bubbles where, apparentl

Re: 8 mil placement, part Deaux!!

Electronics Forum | Fri Sep 11 16:52:00 EDT 1998 | Dave F

0.050" -> 50 mil -> 50 pitch 0.80 mm -> 0.032" -> 32 mil -> 32 pitch 0.64 mm -> 0.025" -> 25 mil -> 25 pitch 0.50 mm -> 0.020" -> 20 mil -> 20 pitch 0.40 mm -> 0.016" -> 16 mil -> 16 pitch 0.20 mm -> 0.012" -> 12 mil -> 12 pitch Dave F

Fine pitch paste release problems.

Electronics Forum | Tue Dec 17 08:46:59 EST 2002 | Randy Villeneuve

Personaly I would try a different solder paste. Give Indium a call and get a sample of their SMQ92J No clean. You will be impressed. Alpha and Kester also have good products but we have a long history with this paste and we have printed millions of b

Aspect Ratio Calculation

Electronics Forum | Tue May 30 07:41:21 EDT 2006 | davef

Aspect ratio: The ratio of a via�s length or depth to its pre-plated diameter. So, in your case, either * 6=0.093/x, calculating x=0.093/6=0.016 as the smallest via hole diameter. ... OR * 6=y/0.01, calculating y=6*0.01=0.06 as the maximum board th

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