Industry Directory | Pick and Place / Soldering
FAROAD, located in Shenzhen, China, has been acting professionally in SMT EQUIPMENT manufacture from the year 2006, concentrating on providing the finest quality equipment at an affordable price.
From Screen printer through to reflow, we have equipment for your SMT Needs. We are the technology leaders in chip shooting and Pick and Place machines. From 0201 to CSP's we can place all of your components.
SMT peripheral equipment mainly refers to: printing press, docking station, Mounter, reflow soldering, AOI, wave soldering and other equipment. SMT peripheral technology is similar to the original hyper threading technology. Users who have experienc
Fast Smart Modular Mounter RS-1R standard 150mm conveyor extensions, 250mm conveyor extensions, upstream and downstream upstream and downstream Board siz
Electronics Forum | Thu Jun 21 16:24:24 EDT 2001 | jdtpfacreate
OEM Boy, Reflow depends on your paste type also. Are you using lead free or will you be going to lead free soon? If your are going to you might want to consider developing two different profiles for lead free and leaded pastes. Good Luck! J.D.
Electronics Forum | Thu Jun 21 16:27:06 EDT 2001 | jdtpfacreate
OEM Boy, Reflow depends on your paste type also. Are you using lead free or will you be going to lead free soon? If your are going to you might want to consider developing two different profiles for lead free and leaded pastes. Good Luck! J.D.
Used SMT Equipment | Pick and Place/Feeders
SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee
Used SMT Equipment | Pick and Place/Feeders
This is a complete SMT Line (INCLUDES *Assembleon Topaz Pick & Place w LCS *MPM AP Excel Screen Printer * choice of Heller 1809EXL Reflow Oven or Vitronics XP730 Reflow Oven *(4) Conveyors [Nutek bypass & CTI double sided Inspection Conveyors *
Industry News | 2019-10-10 11:26:42.0
ZESTRON is pleased to announce that it will host “Multiple Thermal Cycles” on Thursday October 24th, from 1:30 PM to 2:30 PM EDT. This is the final installment of the 2019 ZESTRON Academy Cleaning Webinar Series. Our presenter will be electronics cleaning expert, Jigar Patel, M.S.Ch.E, Senior Application Technology Engineer.
Industry News | 2022-06-16 17:44:51.0
ZESTRON is pleased to announce that it will host "Multiple Thermal Cycles" on Tuesday June 21st, from 11:00 AM to 12:00 PM EDT. This is the fourth installment of the ZESTRON Academy 2022 Cleaning Webinar Series, and will be presented by our industry expert, Jigar Patel, M.S.Ch.E, Senior Application Engineer.
Parts & Supplies | Pick and Place/Feeders
SMT Panasonic BM123 BM221 MSF 8*4MM Double Feeder 10896BF106 for pick and place machine PANASONIC BM123 / BM221 / BM231 / MSF Series Feeders: BM 8W*2P 10896BF101 Double BM 8W*2P N610014231AA Double BM 8W*4P 10896BF106 Double BM 8W*4P N610016060
Parts & Supplies | Pick and Place/Feeders
SMT Panasonic BM MSF MC111 IPAC Double Feeder 8*2mm N610014231A for pick and place machine PANASONIC BM123 / BM221 / BM231 / MSF Series Feeders: BM 8W*2P 10896BF101 Double BM 8W*2P N610014231AA Double BM 8W*4P 10896BF106 Double BM 8W*4P N610016
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Please join ZESTRON Academy as we thoroughly examine the impact of multiple thermal cycles on the effectiveness of the PCB cleaning process. Today, multiple thermal cycles may be required for a variety of reasons in the production of printed circuit
This is a brief demonstration showing the 2014 YESTech FX operating. This machine is available at the Capital Equipment Exchange. www.ce-exchange.com
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 29 00:00:00 EDT 2020 - Thu Oct 29 00:00:00 EDT 2020 | ,
Multiple Thermal Cycles
Events Calendar | Tue Jun 21 00:00:00 EDT 2022 - Tue Jun 21 00:00:00 EDT 2022 | ,
Multiple Thermal Cycles June 21st
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Management Experience: Over 5.5 Years Managing Production, Test, Warehouse, and Process Engneering, while improving overall Quality and Efficience Project Management Experience: Managed Various Cost Reduction projects using Lean Manu
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Over 20 Years Experience with SMT Processes at Large and Medium Sized Companies like Hitachi, Nokia, Siemens, and Variosystems Troubleshooting SMT Process Deficiencies and Recommending Short Term and Long Term Solutions. Developing Technical
Probably the biggest issue with 0201 chip components
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_mask-opening-for-0201-parts_topic43.xml
PCB Libraries Forum : Mask opening for 0201 parts PCB Libraries Forum : Mask opening for 0201 parts This is an XML content feed of
Heller Industries Inc. | https://hellerindustries.com/parts/413902/
413902 - DOUBLE FLAG CBS CHAIN - (METER) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
