Electronics Forum | Mon Nov 13 08:24:03 EST 2000 | G. English
Richard, From your description of the IC, as Wolfgang indicates it sounds like a 20mil pitch device, the aperture design really depends upon your solder paste particle size, we use a type 3 solder paste with a mesh size of �325 / +500microns. This is
Electronics Forum | Fri Jun 05 12:57:20 EDT 1998 | Steve Schrader
| My company recently purchased 3 new Phillips CSM machines and is interested in buying a Screen Printer. The one problem we have is that we have to change setups three to four times a day. Due to the small runs of one type of boards that we do. My
Used SMT Equipment | Flexible Mounters
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Used SMT Equipment | Pick and Place/Feeders
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Industry News | 2013-01-17 09:22:05.0
FCT Assembly announces that it will highlight its new NanoSlic™ Multilayer Coating for the first time in booth #2627 at the upcoming IPC APEX EXPO
Industry News | 2013-05-06 18:13:00.0
Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
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