BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
Sales Manager: Nancy Lin Email: firstname.lastname@example.org Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 Amikon : Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month Amikon supply： New+original+factory sealed+high quali
Electronics Forum | Wed Aug 02 02:31:11 EDT 2006 | CHIPshooter
I have seen 0402 inductors that look identical to 0402 caps, come in embossed reels, but the pitch on the tape was 4mm. Im not saying they dont exist, but i have never seen an 0402 component come in an embossed tape with a pitch of 2mm. everything i
Electronics Forum | Wed Apr 15 17:16:00 EDT 2009 | rmitchell
Hi, I am trying to reduce some 0402 cap tombstones. The main cause is the pad spacing is a little too far apart and the parts are as tall as they are wide .5mm I am stuck with the pad spacing for a while. All other parts are soldering well, even 0
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2009-09-03 13:01:11.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman will hold a presentation titled “Solder Paste Selection Can Improve Cleaning Performance on Highly Dense Medical Electronic Assemblies” at the upcoming Medical Electronics Symposium. The presentation will take place during Session 6, titled “Systems Manufacturing,” chaired by Randy Crutchfield, Product Engineer, Medtronic Microelectronics Center, and will be held on Thursday, September 17, 2009 at Arizona State University in Tempe, AZ.
Industry News | 2015-10-11 15:35:54.0
New placement modules, tapeless feeders, new screen printers and the first expert system that optimizes SMT processes automatically. At Productronica 2015 (November 10-13, Munich Trade Fair Center), technology leader ASM Assembly Systems will present a show unlike any other under the motto “On the move to the Smart #1 SMT Factory”. On 650 square meters at booth A3.377, the SMT experts will lay out their roadmap to the Smart Factory with a “Speed Quality” line and a “Flexible Quality” line featuring totally innovative technologies. The focus will be best-in-class equipment, automation tools, production process networking and integration, and transparent material logistics. At the “Speed Quality” line, new SIPLACE TX placement modules will ring in the mass placement of super-small 0201 (metric) components. A single SIPLACE TX module alone can place up to 78,000 of these per hour at full speed at smallest footprint. With its compact design, it also sets new records in speed, floorspace performance and placement accuracy. Components in sizes from 0402 through 01005 will be supplied loosely and without tapes thanks to the new SIPLACE BulkFeeder. This ASM innovation finally bans reels and splicing from the SMT production floor. With the DEK NeoHorizon and DEK NeoHorizon Back-to-Back, the ASM team will also unveil new, powerful screen printers. Most of the visitors’ attention, however, will be focused on the ASM ProcessExpert. This first inline expert system in the industry establishes a new product category in electronics manufacturing. By running virtual prints based on Gerber data, the ASM ProcessExpert subjects the stencil to a DFM (design for manufacturability) health check. By stabilizing and optimizing the printing process automatically, this highly innovative system represents a milestone on the path to self-optimizing SMT lines. Each of these innovations constitutes a building block for the Smart Factory.
SMT MACHINE GENUINE Juki Spare Parts JUKI 775 HEAD MAIN BUSH ASM E30188020A0 Pats Specifications: Brand Name JUKI 775 HEAD MAIN BUSH ASM Part number E30188020A0 Model JUKI SPARE PARTS Ensure Test in machine confirmation Guarantee 1 month
Detailed Product Description Part Name: Servo Motor Part Number: MSMA012A3A Power: 0.1KW Voltage: 84V Brand: Panasonic Use: CP45NEO MSMA012A3A Servo Motor Driver Samsung CP45NEO J9080123 / J3108059A Mirror Motor Parameter: Brand Part Name
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
. Packing, 5322 532 12546 Chevron seal used in Piston assembly Packing 5322 532 13169 Packing 5322 530 51347 Packing, 5322 530 10289 O-ring, plugs 5322 530 51297 O-ring, metal caps 5322 530 10474 O-ring, plastic caps 5322 530 10292 O-ring, inlets 5322 530 10442 O-ring 5322 530 10441 O-ring 5322 502 60165 Screw (M2x3
probably use it for all parts rather than just small parts and IC's. Twin heads are great as I can fit two different nozzles and use the larger nozzle on Head 2 for electro caps and large IC's and the and not have to stop the job to change nozzles