New SMT Equipment: 0402 l pattern spacing (153)

UV Laser PCB Depaneling System, Dual Table for High Volume

UV Laser PCB Depaneling System, Dual Table for High Volume

New Equipment | Depaneling

UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration

Winsmart Electronic Co.,Ltd

full-auto screen printing machine for LED board

full-auto screen printing machine for LED board

New Equipment | Printing

ASCEN S8 PCB screen printer is the most economy with high precision In-line full-auto  LED screen printing machine, especially for LED flexible strip production. PCB is fixed on the flexible work table via PCB transportation system ,wh

ASCEN Technology

Electronics Forum: 0402 l pattern spacing (3)

IPC Land Pattern Guideline

Electronics Forum | Thu Oct 20 10:31:27 EDT 2011 | ck_the_flip

What is the industry standard pad geometry (dimensions and spacings) for 0402 components?

Tombstoning

Electronics Forum | Wed Jun 12 10:42:06 EDT 2002 | stepheno

Check your land patterns. I believe someone once made a typo on specs for land pattern spacing and the specs are still being used by some people. I worked for a CM that had a customer that spaced the pads for 0402's too far apart. It was the only

Used SMT Equipment: 0402 l pattern spacing (6)

Samsung SM411

Samsung SM411

Used SMT Equipment | Pick and Place/Feeders

Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and

KingFei SMT Tech

Yamaha yv100xe used machine

Yamaha yv100xe used machine

Used SMT Equipment | Pick and Place/Feeders

yv100xe used machine Substrate size ATS20 (final placement) W-AT assembly: L460*W250(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 SMD components can be placed in 100 kinds (8MM) Substrate transfer direction right-left Mounting accuracy ±0.1mm/C

CNSMT CO.LTD

Industry News: 0402 l pattern spacing (2)

CupraEtch™ DT25 - Atotech’s New Photoresist Adhesion Process

Industry News | 2014-01-16 09:31:26.0

The increased challenge of miniaturization with increased functionality within the PCB industry leads to the constant need for new technologies for high volume manufacturing. As line and space features decrease, requirements on the photoresist as well as its pre-treatment steps increase.

Atotech

DEK and Gore Introduce snapSHOT� Board-Level EMI Shielding Solution

Industry News | 2003-02-14 08:03:50.0

Provides Devices with Excellent Protection Against EMI and Overcomes Limitations of Metal Cans

ASM Assembly Systems (DEK)

Parts & Supplies: 0402 l pattern spacing (2)

Juki High Speed Technology SMT JUKI Chip Mounter Machine FX-3 With Multi Laser Head

Juki High Speed Technology SMT JUKI Chip Mounter Machine FX-3 With Multi Laser Head

Parts & Supplies | Assembly Accessories

SMT JUKI High-speed Modular Mounter FX-3 with better price now JUKI HIGHT SPEED SHOOTER KE2050 KE2060 KE2070 KE2080 KE1070 KE1080 FX-1R FX-2 FX-3 Sell & Buy smt machine and spare parts. Pls don't hesitate to contact me if you have any requi

KingFei SMT Tech

Juki JUKI releases FX-3 High Speed Modular Mounter for High Volume Circuit Board Assembly

Juki JUKI releases FX-3 High Speed Modular Mounter for High Volume Circuit Board Assembly

Parts & Supplies | Pick and Place/Feeders

Starting in May 2008, JUKI Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp

ZK Electronic Technology Co., Limited

Videos: 0402 l pattern spacing (3)

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Videos

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com

Nordson ASYMTEK

screen printing machine,PCB screen printer , auto pcb screen printer , LED screen stencil printer, PCB solder paste printer

screen printing machine,PCB screen printer , auto pcb screen printer , LED screen stencil printer, PCB solder paste printer

Videos

ASCEN S8 PCB screen printer is the most economy with high precision In-line full-auto  LED screen printing machine, especially for LED flexible strip production. PCB is fixed on the flexible work table via PCB transportation system ,wh

ASCEN Technology

Express Newsletter: 0402 l pattern spacing (332)

Partner Websites: 0402 l pattern spacing (78)

Servo Pump Deferred Revese

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Software-Guide-Addendum-Deferred-Reverse.pdf

Description 7/12/19 GPD Global® 13 Servo Pump Deferred Reverse References Fill Width The wall dimension (the width of each side) of a hollow rectangle. The pattern is covered in increments of Fill Spacing needle diameters and motion is at vector speed Dispense

GPD Global

software crosschecking PCB component footprint and bom footprint. | Unisoft

| https://unisoft-cim.com/crosschecking-pcb-component-footprint-and-bom-footprint.html

(correct solder pad size and land pattern) for the same component listed in the Bill of Materials (BOM).    The mismatch of component footprint spacing is usually an error created when components on the PCB assembly ( PCBA


0402 l pattern spacing searches for Companies, Equipment, Machines, Suppliers & Information

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