Industry Directory | Manufacturer
Contract manufacturer of hybrid ICs and PCB assemblies
Industry Directory | Manufacturer
Manufacturer of sintering, electrically conductive materials. Applications include semiconductor die attach, component attach, via fill, z-axis interconnection, conductive lines and traces and plated-through hole fill.
YAMAHA YG100R HIGH SPEED PICK AND PLACE MACHINE Model YG100RA(FNC TYPE )/YG100RB(SF TYPE) Object substrate L50×W50mm ～L510×W460mm Mounting efficiency 24000CPH/CHIP (
JUKI 0402 Feeder CF05HPR 40081759 JUKI 0402 Feeder CF05HPR 40081759 SMT Spare Parts JUKI Spare Parts Delivery time: 1-3 days Product description: JUKI 0402 Feeder CF05HPR 40081759 INQUIRY JUKI 0402 Feeder CF05HPR 40081759 Specificat
Electronics Forum | Thu Aug 17 12:18:40 EDT 2017 | cyber_wolf
I do not see anything obvious that would cause a thermal mis match. Regarding reflow profiles reducing tombstoning, Unless there is something wrong with your paste or you are running smaller than 0402's, I have NEVER seen a reflow profile reduce tom
Electronics Forum | Tue Apr 21 16:33:06 EDT 2009 | llaerum
Home plate design is great for avoiding beads and tombstoning in some cases, but it will not help you when the spacing is too far apart. It will make it worse. You need a good even screen and accurate placement.
Used SMT Equipment | SMT Equipment
Product name: YS100 high speed universal module chip mounter Product number: YS100 Products in detail The characteristics of 25000 CPH (equivalent to 0.14 seconds/CHIP: best conditions) ability of high speed SMT All the time, SMT absolute a
Used SMT Equipment | Pick and Place/Feeders
Product number: YS100 Products indetail The
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2013-09-25 16:06:25.0
On September 23, 2013, the National Development and Reform Commission (NDRC) of China issued a circular postponing the implementation of the regulation that would have eliminated cyanide-gold plating at the end of 2014.
Parts & Supplies | Pick and Place/Feeders
JUKI FEEDER PARTS FULL SERIES Part Name：8MM FEEDER 本体轴承 PART No：SB304000100 Part Name：UPPER COVER 3212ST ASM. 1 新款压料盖 PART No：E6203706RB0 Part Name：PRESSURE ROLLER ASM. PART No：E1321706AA0 Part Name：TAPE HOLDER PLATE PART No：E1321706C00 Par
Parts & Supplies | Pick and Place/Feeders
JUKI FEEDER PARTS FULL SERIES Part Name：8MM FEEDER 本体轴承 PART No：SB304000100 Part Name：UPPER COVER 3212ST ASM. 1 新款压料盖 PART No：E6203706RB0 Part Name：PRESSURE ROLLER ASM. PART No：E1321706AA0 Part Name：TAPE HOLDER PLATE PART No：E1321706C00 Par
Technical Library | 2016-07-21 18:16:06.0
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material, but can be significantly impacted by PCB fabrication practices. In addition to appropriate circuit materials and circuit design configurations to meet target performance goals, a number of PCB material-related issues can affect final performance, including the use of soldermask, the PCB copper plating thickness, the conductor trapezoidal effect, and plating finish; understanding the effects of these material issues can help when fabricating high-frequency circuits for the best possible electrical performance.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
New Upgrade — I.C.T SMT LED Flexible Pick and Place Machine M series In 2022, we have upgraded the equipment of the M series pick and place machine for SMT Production line. I.C.T M series pick and place machine is mainly used for the producti
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
Career Center | nagercoil, India | Maintenance,Production
3.5 year's experience in smt. Am looking for a growth orinted organization .
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_altium-0402-resistor-footprint_topic2596.xml
://www.pcblibraries.com/LibraryExpert/Pro/ Altium 0402 Resistor Footprint : I did hear about this issue, but... Author: Tom HSubject: 2596Posted: 27 Feb 2020 at 11:14amI did hear about this issue, but everyone should know that Land Pattern Calculators are very complex to create and then you must maintain them as new technology emerges
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) and its compounds in some of their manufacturing operations, such as solder plating. This article aims to provide the reader some basic background information on the semiconductor industry's "lead-free" (Pb-free) initiatives
