Industry Directory: 0402 recommended pads size (1)

PCB Assembly Express

Industry Directory | Service Provider

PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.

New SMT Equipment: 0402 recommended pads size (133)

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

PCB Pad Repair Kit

PCB Pad Repair Kit

New Equipment | Rework & Repair Equipment

The BEST PCB pad repair repair kit gives you the tools you need for fast modification and repair of PCB circuit pads-no matter what their size. Our online PCB repair training videos, our master instructors along with these materials allows you to mee

BEST Inc.

Electronics Forum: 0402 recommended pads size (201)

0402

Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo

Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen

Re: pads size

Electronics Forum | Tue Apr 06 09:42:08 EDT 1999 | Justin Medernach

| Hi, | Somebody know how to calculate the size of pads for different IC's: QFP's, SOIC, SOJ, etc. | | any help is apreciated. | | thanks | | AC | Hi AC, Recommended pad geometries come with component specs. Your circuit will be comprised of giv

Used SMT Equipment: 0402 recommended pads size (2)

Cyberoptics CyberOptics SE500

Cyberoptics CyberOptics SE500

Used SMT Equipment | SPI / Solder Paste Inspection

All the machines have been maintained by the manufacturer or the official distributor in accordance with required maintenance schedule. ASK QUOTATION! Dimensions Unit Height 139 cm (55 in.) excluding signal-light pole and leveling feet Unit Wi

Privalar OÜ

ACE KISS - 104

ACE KISS - 104

Used SMT Equipment | Soldering - Selective

ACE KISS 104 Selective Solder Model: KISS 104 Vintage: 2007 Voltage: 115/120 Two (2) pots - One leaded, one lead-free FEATURES: The KISS-104 is a fully configured In-Line SMEMA compatible Selective Soldering Machine ready to produce your produ

Recon Inc

Industry News: 0402 recommended pads size (36)

Tens of Millions of Footprints & 3D Models for FREE

Industry News | 2017-05-11 17:06:16.0

Library Expert Lite automatically builds footprints and 3D STEP models for tens of millions of parts, for free.

PCB Libraries, Inc.

Practical Components Supplies NEWLY UPDATED AIM Print Test Board and Kit

Industry News | 2010-04-10 23:59:50.0

LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.

Practical Components, Inc.

Parts & Supplies: 0402 recommended pads size (1)

Samsung Smt Nozzle CN220 for CP45Neo

Samsung Smt Nozzle CN220 for CP45Neo

Parts & Supplies | Other Equipment

We support Samsung Smt Machine spare parts for CP30,CP33,CP45,CP45NEO,CP60,CP55,CP10,CP11, SM321,SM320,SM411,SM421,SM431,SM471 etc machines nozzle, Feeder, CPU Board, IO Board, Laser, Cable, Feeder cart, Motor, Driver ect thanks CP30

Jinchen Electric Technology Co,.Ltd

Technical Library: 0402 recommended pads size (1)

Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP

Technical Library | 2015-12-02 18:32:50.0

(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.

Altera Corporation

Videos: 0402 recommended pads size (9)

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Videos

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com

Nordson ASYMTEK

PCB Library Expert

PCB Library Expert

Videos

The PCB Library Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts footp

PCB Libraries, Inc.

Events Calendar: 0402 recommended pads size (2)

SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices

Events Calendar | Tue Feb 10 13:00:00 EST 2015 - Tue Feb 10 14:30:00 EST 2015 | ,

SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices

Surface Mount Technology Association (SMTA)

Design & Assembly of 0201, 01005 and Next Generation Chips

Events Calendar | Mon May 11 14:30:00 EDT 2015 - Mon May 11 14:30:00 EDT 2015 | ,

Design & Assembly of 0201, 01005 and Next Generation Chips

ASKbobwillis.com

Express Newsletter: 0402 recommended pads size (418)

Partner Websites: 0402 recommended pads size (427)

Layout 1

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_AdvMicroSMT.pdf

in size from 0603, 0402, 0201, 01005, as well as multi-leaded extra fine pitch devices. This course is an extensive and repetitive “hands-on” experience

Conductive Adhesive & Non-Conductive Adhesive Dispensing

GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-adhesive-application.php

. Jet dispensing can be used when deposit size needs to be a dot diameter or line width down to 0.4 mm. Jet dispensing is also recommended if substrate is not particularly flat

GPD Global


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