Refurbished YAMAHA YV100xg Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute
YAMAHA Second-Hand YV180XG Pick and Place Machine Model YV180XG Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting an
Electronics Forum | Sun Apr 25 12:05:50 EDT 1999 | Chrys Shea
| | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free solderin
Electronics Forum | Mon Apr 26 09:18:27 EDT 1999 | C.K.
| | | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free so
Used SMT Equipment | SMT Equipment
Model :KE-1070 Pick and Place Machine Placement speed:Chips:18900CPH(0.190sec/chip) Component mount range:0603 chips ~33.5mm Station:80 Power supply:3-phase AC200~415C 3KVA Size:1500*1500*1455mm Weight:1590kg
Used SMT Equipment | SMT Equipment
Model :JX-100 Pick and Place Machine Placement speed:Chips:19300CPH(0.187sec/chip) Component mount range:0603 chips ~33.5mm Power supply:3-phase AC200~415C 1.5KVA Size:1370*1270*1440mm Weight:1000kg
Industry News | 2020-02-18 14:55:07.0
Team offers its expertise in conformal coating and fluid dispensing equipment solutions for Swiss electronics manufacturing
Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Parts & Supplies | Pick and Place/Feeders
Juki CF03HPR FEEDER 0201 Specs: 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 0603 40081759 CF05HPR 8mm TAPE FEEDER UNIT FOR 1005 40081760 CF08HER 8mm TAPE FEEDER UNIT (2MM PITCH) 40081761 CF081PR 8mm TAPE FEEDER UNIT 40081762 CF081ER 8
Parts & Supplies | Pick and Place/Feeders
Juki CF03HPR FEEDER 0201 Specs: 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 0603 40081759 CF05HPR 8mm TAPE FEEDER UNIT FOR 1005 40081760 CF08HER 8mm TAPE FEEDER UNIT (2MM PITCH) 40081761 CF081PR 8mm TAPE FEEDER UNIT 40081762 CF081ER 8
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
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LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
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PANASONIC MSHG1 Small nozzle 0603 MSHG1 Small nozzle 0603 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products SMT Nozzles MSHG1 Small nozzle 0603 Public Pricelist Public
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Pick and Place Machine Paper feeder Sony Feeder GAK-0804 P100 Sony 8x4mm Paper SMT Feeder Leave a Message We will call you back soon