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Electronics Forum | Wed Feb 29 06:33:49 EST 2012 | amitsindwani
Please define the defect in following conditions & link to IPC 610 clause/sub-clause no.: 1. 0603 component placed on 0805 PCB pad 2. 0805 component placed on 0603 PCB pad 3. 1206 component placed on 1210 PCB pad and 4. 1210 component placed on 1206
Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas
We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is
Parts & Supplies | Assembly Accessories
Yamaha Feeder available: YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1300-000 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-030 Yamaha CL 12mm Feeders KW1-M2200-300 Yamaha CL 16mm Feeders K
Parts & Supplies | Assembly Accessories
Yamaha Feeder available: YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1300-000 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-030 Yamaha CL 12mm Feeders KW1-M2200-300 Yamaha CL 16mm Feeders K
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
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YAMAHA YS12F Flexible SMD SMT Pick And Place Machine For 0402 0603 0805 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_yageo-0603-resistor-solder-patterns_topic2613.xml
= 10,111 0603 Yageo resistors on POD and they alluse the IPC-7351 guidelines.Here is the difference – IPC-7351 – L pad length = 0.74, W pad width = 0.93 and Spad gap = 0.85Yageo Resistor 2004
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