Design and development of analytical equipment for Chemistry research.
Panasonic NPM Modular SMT Chip Mounter Machine Product name Panasonic NPM SMT Chip Mounter Model NPM-D3 NPM-W2 NPM-TT2 NPM-W2S Concept Dual-gantry, multi-head, process-driven module Dual-gantry,
KINGSUN 800CS COMPUTER AIR COOLING REFLOW OVEN Model: 800CS Dimension (L * W * H) 4200*850*1350 Number of heating zones Up / Down 8 Number of cooling zones Up 1 Emission requirements 10m3 /min*2( channel ) Heating time About 15 minutes Temperature
Electronics Forum | Tue Apr 19 09:06:51 EDT 2005 | russ
1005 breaks down like this in mm. the "10" equals 1.0 mm, the "05" equals 0.5mm so, 1005. in inch conversion 1.0mm = .04", 0.5mm = .02" so 0402 (.04" x.02" = 1.0 x 0.5). Hope this helped.
Electronics Forum | Mon Feb 04 12:28:28 EST 2008 | jseagle
1.0mm (0.039") 1.75X >0.5 to 1.0mm (0.02 to 0.039") 4X 0.25 to 0.5mm (0.00984 to 0.02") 10X
Used SMT Equipment | Pick and Place/Feeders
OS: Windows XP SW: 8.5.5.1 Lightning Feature Cameras: OTHC (Narrow fov) beam 1 firewire 1394 .55 per pixel. OTHC (Narrow fov) beam 2 firewire 1394 .55 per pixel. Pecs: pec beam1 firewire 1394 1.0 mil per pixel. pec beam 2 firewire
Used SMT Equipment | Pick and Place/Feeders
Serial: 10101112 Windows XP SW: 8.5.5.1 Lightning Feature Cameras: OTHC (Narrow fov) beam 1 firewire 1394 .55 per pixel. OTHC (Narrow fov) beam 2 firewire 1394 .55 per pixel. Pecs: pec beam1 firewire 1394 1.0 mil per pixel
Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
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Parts & Supplies | Pick and Place/Feeders
Part Name：TAPE GUIDE ASSY CP6/CP7/CP8/XP ø1.0～ø1.8 Part No：AKJAC 9080
Technical Library | 2021-05-20 13:41:30.0
Adoption and integration of USB-C chargers and hubs in automotive applications is driving a need for an updated approach to production tests due to USB-C's connector density, high bandwidth, and high power. We introduce a new paradigm in test-system development, micro-FCT (micro Functional Test), and demonstrate developing and deploying of an end-of-line (EOL) functional test-system which meets the strict automotive test requirements for a USB-C hub. Specification to deployment of the test-system was completed in less than 10-weeks, and test cycle time was 1/10th of the customer's requirements
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Events Calendar | Thu Dec 05 00:00:00 EST 2019 - Thu Dec 05 00:00:00 EST 2019 | ,
Webinar: Update on New IPC-1752B Supply Chain Standard — Preparing for Submissions to the ECHA SCIP Database
Events Calendar | Thu Aug 31 00:00:00 EDT 2017 - Thu Aug 31 00:00:00 EDT 2017 | Shenzhen, China
NEPCON and Smart Factory 1.0—The Future of Electronics Manufacturing
Career Center | Roanoke, Virginia USA | Engineering,Management,Production
About Keltech: Keltech is an employee owned ISO certified electronics manufacturing service provider specializing in surface mount and mixed technology assemblies. Why do our employees choose Keltech for a career? What separates Keltech from other c
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
Career Center | New Delhi, India | Engineering,Maintenance,Management,Production,Quality Control,Sales/Marketing
Embedded System: 8085 Microprocessor, 8051Microcontrollert, 16 bit Renesas Microcontroller, ARM7, UART, RS-232, IR Sensor, Hall Sensor, Fingerprint Module, RF Module, EEPROM and GSM. VLSI, VHDL. Software’s Knowledge: Keil3, Flash Magic, Prog5
