Industry News | 2023-06-26 09:34:58.0
IPC releases EMS industry results for May 2023
Industry News | 2023-07-31 19:19:11.0
IPC releases EMS industry results for June 2023
Industry News | 2003-03-20 08:33:22.0
Jabil Circuit Inc. said it expects its third fiscal quarter to generate revenue between $1.2 and $1.24 billion and earnings per diluted share in the 17 to 19 cent range.
Industry News | 2001-07-20 07:56:23.0
South Korea's Samsung Electronics said on Friday it expects demand in dynamic random access memory (DRAM) chips to stay below supply until the fourth quarter of the year.
Industry News | 2015-10-18 19:48:29.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced the availability of the Mentor® Automotive Safety Certifiable Digital Instrument Cluster solution enabling safety-critical driver information to be displayed simultaneously with rich 3D graphics on a single instrument cluster display. The software architecture is implemented on a multi-core and even on single-core System-on-Chip, and features very fast boot time. This new solution addresses a key problem for the automotive OEMs: How to migrate safety-critical driver information to full-featured, graphically-rich digital instrument clusters and comply with safety standards including ISO 26262, without pushing up hardware or safety certification costs.
Industry News | 2015-03-23 12:27:07.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.
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