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New Equipment | Industrial Automation
Cambia Automation Limited Contact Freely Manager: Leeta Wu Email: sales2@cambia.cn company website：www.cambiaplc.com Mobile: +86 15960236674 Skype: +86 5960236674(Whatsapp/ Wechat) You Want to Know Wa
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New Equipment | Industrial Automation
Cambia Automation Limited Contact Freely Manager: Leeta Wu Email: sales2@cambia.cn company website：www.cambiaplc.com Mobile: +86 15960236674 Skype: +86 5960236674(Whatsapp/ Wechat) You Want to Know Wa
Electronics Forum | Fri Jul 08 12:31:01 EDT 2011 | smtlogics
I am evaluating PACE IR300 rework system for micro BGA having size .85mm x 1.35mm. Is anyone out there has any experience of reworking this package size BGAs. Your comments will be appreciated.
Electronics Forum | Thu Jan 28 11:56:53 EST 2010 | alexino76
Yes, u're right... U can do with Flexprogram; this is the dos based program that convert a zevatech file in a txt file or viceversa. You simple convert your PM file as txt and reconvert as FM740 format (g3g). After conversion u have to complete compo
Used SMT Equipment | Pick and Place/Feeders
Japan YAMAHA YV100-XTG placement machine: Patch speed: 0.135 seconds/CHIP SMD PCB size: L330XW250MM_L50XW50MM SMD components:0603(MM)-31MMX31MM components SOP SOJ PLCC SMD components can put 100 kinds (8MM) Mounter size: L1650XW1408X1
Used SMT Equipment | Pick and Place/Feeders
Japan YAMAHA YV100-XTG placement machine: Patch speed: 0.135 seconds/CHIP SMD PCB size: L330XW250MM_L50XW50MM SMD components:0603(MM)-31MMX31MM components SOP SOJ PLCC SMD components can put 100 kinds (8MM) Mounter size: L1650XW1408X1
Industry News | 2005-04-26 15:48:02.0
New family of high-threshold, low on-resistance power MOSFETs for automotive and other high-current, high-temperature applications was issued by Siliconix.
Parts & Supplies | Air / Vaccuum
KM1-M7162-20X A010E1-35W KV6-M7171-10X VALVE ASSY YAMAHA KOGANEI VACUUM EJECTOR ME12 YAMAHA KOGANEI VACUUM EJECTOR AME-E2-PSL-13W 10W KGA-M37P1-00X G010HE1-5W 5322 360 10327 KHY-M7152-00 EJECTER 21W+34W YS12 KG2-M8582-40X. VALVE YAMAHA
Parts & Supplies | Other Equipment
KM1-M7162-20X A010E1-35W EJECTOR valve for yamaha smt machine KM1-M7163-20X A010E1-37W KM1-M7163-21X A010E1-54W KM1-M7163-30X A010E1-44W KGA-M7111-H0X A041E1-48W 88X KM5-M7174-11X AME05-E2-PSL-13W KV7-M7111-B0X A041E1-11-48W KM1-M7162-
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 2015-02-05 23:23:40.0
Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today's high pin count, high frequency integrated circuits. However, that same pin density and unique interface create a challenge unique unto themselves. These challenges need to be faced head on since the ball grid array (BGA) is prevalent in modern PCBs. While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs.
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ABLIC&PN=S-8261AAJMD-G2JT2G
: Active Mounting Type: Surface Mount Logical Description: IC, Battery Protection 1-Cell Pack Physical Description: Small Outline Transistor (SOT23), 0.95 mm pitch; 6 pin, 2.90 mm L X 1.60 mm W X 1.35 mm H body Commonly Visited
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/SimpleCoat-Series-Facility-Specifications-23100603.pdf
& Rotate Coating System SimpleCoat TR Large Footprint W x D x H 1.0 m x 1.40 m x 1.55 m (39.37” x 55.12” x 61.02”) 1.26 m x 1.35 m x 1.54 m (49.5” x 53” x 60.5”) Conveyor height Transport height 940 - 965 mm
