Electronics Forum: 1.4 (Page 1 of 22)

Universal GSM1 UPS Rev. 1.4

Electronics Forum | Mon Jun 26 03:00:15 EDT 2000 | armin

Hi, Anybody there running GSM1 UPS Rev 1.4 with OS/2 4.0 Warp ? We have OS/2 2.11 and we plan to upgrade to OS/2 4.0 Warp. I'm afraid of some incompatibility issues might occur. Please feedback any incompatibility issues you encountered in case you h

Re: Universal GSM1 UPS Rev. 1.4

Electronics Forum | Mon Jun 26 16:56:54 EDT 2000 | FlynHi

Why do you want to go to WARP? I hope someone did not suggest WARP was the answer to some problem. I don't think you will have any trouble upgrading to WARP.

Re: Universal GSM1 UPS Rev. 1.4

Electronics Forum | Mon Jun 26 12:53:15 EDT 2000 | JAX

Armin, I don't think you will have any problems changing to 4.0 but why would you want to? Why change your system software and leave your platform software at an old rev.? Upgrading UPS will be far more benificial. More Vision opportunities, faster p

Mydata TP9 feeders

Electronics Forum | Fri Feb 15 11:18:08 EST 2013 | richardc

Does anyone know the mechanical differences between a TPsys 1.6 version feeder and a 1.4. I only need to have one feeder for the 1.4 machine and would modify a 1.6 feeder if that is an option. Otherwise, does antone have a 1.4 version feeder they w

V-scoring design and equipment questions

Electronics Forum | Mon Jun 12 14:33:40 EDT 2006 | pjc

IPC spec is V-score shall not be more than 1/2 board thickness. They should be V scoring 1/4 off top and 1/4 off bottom equally.

tpsys 1.4.7 software

Electronics Forum | Mon Dec 04 18:12:45 EST 2006 | Say

Does anyone have a tpsys 1.4.7 software or the servo? Please contact me at sbounsavath@rad-tech.net or call me at 818-381-8500 ext.555. -Say

Re: 0201 components

Electronics Forum | Thu Feb 24 20:45:01 EST 2000 | Todd Woods

1.4 seconds. We found a step function decrease at 1 second.

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla

We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n

Milling durstone

Electronics Forum | Mon Dec 20 09:46:21 EST 2010 | azbvc

I have to make a few fixtures using durostone Material. I would like to know what end would be best to use for milling pockets out. I tried using HSS 1/4 in all I did was burn it up. Also I tried to use a 1/4 " carbide end and burnt that up too. any

Juki optimisation

Electronics Forum | Fri Mar 23 19:50:57 EDT 2007 | Frank

Possible head combinations to pick from multiple 12, 16, or 24mm feeders. Note: you can not mix feeder sizes for simultaneous picks. KE-2010 and KE-2050 will use 1&3, 2&4, or 1&4 KE-2020 and KE-2060 will use 1,3,R or 2,4,R or 1,4,R I prefer to s

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