Industry Directory: 1.6 (27)

AUSPI ENTERPRISES CO., LTD

Industry Directory | Manufacturer

We can provide you all types of PCBs, including rigid (1~30layers), flex (1~6layers) and rigid-flex circuits (1~6layers) no m

New SMT Equipment: 1.6 (18652)

DEK Horizon 02i Automatic Screen Printer

DEK Horizon 02i Automatic Screen Printer

New Equipment | Printing

DEK Horizon 02i Automatic Screen Printer Dek Horizon Repeatability: 1.6 Cpk @ 25µm Cycle time: As fast as 10 seconds Setup time less than 10 minutes Changeover time: less than 2 minutes Optimised Printer Frame common to all Horizon machines Accept

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

KE - 2070 JUKI high-speed chip mounter

KE - 2070 JUKI high-speed chip mounter

New Equipment | Pick & Place

Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Electronics Forum: 1.6 (161)

I need venix 1.6.????? Boot disk or set to buy or borrow. Please

Electronics Forum | Mon Feb 27 23:11:44 EST 2012 | ev

Can you give me some more info I think I might be able to help. Are these boot disks that come with the machine and is it 1.6 version? Ev

Mydata TP9 feeders

Electronics Forum | Fri Feb 15 11:18:08 EST 2013 | richardc

Does anyone know the mechanical differences between a TPsys 1.6 version feeder and a 1.4. I only need to have one feeder for the 1.4 machine and would modify a 1.6 feeder if that is an option. Otherwise, does antone have a 1.4 version feeder they w

Used SMT Equipment: 1.6 (112)

Siemens HF

Siemens HF

Used SMT Equipment | Pick and Place/Feeders

2006 Siemens HF SMT Pick & Place Cycles: 29,971,511 Note: The following items are included with this machine: (3) Feeder Carts (1) MTC 2 (1) 6 Segment Placement Head Serial: A368-12031214 Item Location: Guadalajara, Mexico

Baja Bid

Mydata TP9-2U

Mydata TP9-2U

Used SMT Equipment | Pick and Place/Feeders

Make: Mydata Model: TP9-2U S/W: Version 1.6.10 Description: SMT Pick & Place Machine Condition: Operational Location: TX, USA

Baja Bid

Industry News: 1.6 (111)

Rogers� Q4 Sales Up 7%

Industry News | 2003-02-13 07:53:53.0

Belgian Laminate Plant Set to Come Online

SMTnet

More Light from Smaller LEDs

Industry News | 2003-04-23 08:21:34.0

Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.

SMTnet

Parts & Supplies: 1.6 (1332)

Panasonic PA Reflecting

Panasonic PA Reflecting

Parts & Supplies | SMT Equipment

PA Reflecting Part Name:1#反光板(白色) PART No:102241013104 Part Name:5#反光板(白色) PART No:102241013502 Part Name:反光板(橙色) D=1.6 PART No:102246572101 Part Name:反光板(橙色) D=8.0 PART No:102246575101 Part Name:2#反光板(白色) PART No:102241013202

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Panasonic PA Reflecting

Panasonic PA Reflecting

Parts & Supplies | SMT Equipment

PA Reflecting Part Name:1#反光板(白色) PART No:102241013104 Part Name:5#反光板(白色) PART No:102241013502 Part Name:反光板(橙色) D=1.6 PART No:102246572101 Part Name:反光板(橙色) D=8.0 PART No:102246575101 Part Name:2#反光板(白色) PART

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: 1.6 (1)

Latent heat induced deformation of PCB substrate: Measurement and simulation

Technical Library | 2022-12-05 16:28:06.0

The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.

Czech Technical University in Prague

Videos: 1.6 (285)

Siemens PL EA 03012564-03

Videos

03027548-01 Guide, left-hand side 03027563-01 Loctite 7063 CLEANER 03027570-03 HOTLINK CARD CPCI A14 K-01 03027644-01 HOLDER FOR CABLE INTERFACE 03027646-02 JUMPER 120 Ohm SUD-D PIN 03027905-01 Adapter cable MTC2 CAN bus 03028249-02 Pneumatic S

Qinyi Electronics Co.,Ltd

Juki 2050(2060) XY BEAR HEAD CABLES ASM 40002234

Videos

40001096 CENTERING PIN 2.5 40001097 CENTERING PIN 2.0 40001098 CENTERING PIN 1.9 40001099 CENTERING PIN 1.8 40001109 MNLA HEAD ASM. 40001110 MNLA HEAD BRACKET AS 40001113 T PULLEY 1 40001114 T PULLEY 2 E86887000A0 LED PS PWB ASM     E8688700

Qinyi Electronics Co.,Ltd

Training Courses: 1.6 (2)

Hands-On PLC Training Workshop

Training Courses | | | Other Courses

Other courses related to electronics manufacturing and assembly

Business Industrial Network

PLC Training workshop

Training Courses | | | Other Courses

Other courses related to electronics manufacturing and assembly

Business Industrial Network

Events Calendar: 1.6 (4)

Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications

Events Calendar | Tue Nov 09 00:00:00 EST 2021 - Tue Nov 09 00:00:00 EST 2021 | ,

Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications

Surface Mount Technology Association (SMTA)

Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications

Events Calendar | Tue Nov 09 00:00:00 EST 2021 - Tue Nov 09 00:00:00 EST 2021 | Chelmsford, Massachusetts USA

Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications

Surface Mount Technology Association (SMTA)

Career Center - Resumes: 1.6 (7)

Electronics job

Career Center | Hyderbad, India | Engineering

i do not have any experiwnce.iam passedout b.tech in the strem of e.c.e in the year 2017.iam very intersted like passion to do job on electronics i liked sooo much that type of job.i will search about that job in seceredarbad.iam aslo stydying m.tech

varshanth resume

Career Center | madak, AP India | Engineering,Research and Development,Technical Support

i have zero experience.

Express Newsletter: 1.6 (21)

Partner Websites: 1.6 (286)

7369K - PROBE T/C, 1.6 mm DIA, Single

Heller Industries Inc. | https://hellerindustries.com/parts/7369k/

7369K - PROBE T/C, 1.6 mm DIA, Single Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

Panasonic MSH3 Nozzle 0402 0805 0603 1.6 2.2 2.5

KingFei SMT Tech | https://www.smtspare-parts.com/sale-37303915-panasonic-msh3-nozzle-0402-0805-0603-1-6-2-2-2-5.html

Panasonic MSH3 Nozzle 0402 0805 0603 1.6 2.2 2.5 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech


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