Electronics Forum | Mon Nov 19 06:06:28 EST 2012 | ericrr
Hi ENIAC That table is part of a mush bigger article I was putting together, and will post somewhere at this website soon, as a one stop complete information. The hold up was Electrolytics and Tantalums code is different but there is no way to t
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Sat Mar 24 00:50:24 EST 2001 | PeteC
Fresh paste from a factory sealed container. Should paste be scrapped out altogether if left on the stencil for too long (length-of-time?)? Our paste is Multicore CR39. Multicore reccomended the print chamber be around 22C @ 50%-60% RH. Our plant is
Electronics Forum | Wed May 07 08:10:22 EDT 2003 | Pon
Hi all Are there any advice pls. let me know. Our customer Void spec. at BGA and CSP is less than 10%. Usually we found void defect at BGA and CSP component around 2-3 % but sone lot the defect rate is up to 18%. I have read some input from this w
Electronics Forum | Tue Mar 22 12:11:15 EST 2005 | jdengler
Bob, I don't have 300 stencils only about 83 so my way might not be practical for you. This is what I have done. 1. I have racks that hold 20 stencils, 10 top 10 bottom. 2. Number the racks and have them in order. 3. Made a number system for locati
Electronics Forum | Wed May 27 16:39:33 EDT 2009 | rmitchell
Hi, I think vision 20 will work as well. If not we have used 100 or 105. Have you tried placing the part with the machine trace on? If so is it finding all the leads? any error codes? If you are defining the leads in the EL lead data I would not d
Electronics Forum | Thu Apr 14 13:10:49 EDT 2005 | Shean Dalton
Hi John, A primary consideration is the type of flux you are using. If it's water soluble (organic acid) then cleaning is highly recommended. Any other flux that fails the copper mirror test, we'd strongly recommend cleaning. Passing the copper m
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
Electronics Forum | Sat Jul 22 03:27:36 EDT 2023 | shrikant_borkar
hi here are consolidated inputs to you you must validate before establishing your process. ESD-safe Material: Ensure that the masking tape is made of ESD-safe materials that have low triboelectric charge generation. Common materials used in ESD-sa
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