Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
Industry Directory | Distributor / Manufacturer
eTECH Supply is a distribution company focused on the needs of Printed Circuit Board Assembly & Repair industry.
New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
New Equipment | Industrial Automation
1769-IR6 1769-IR6 ZhongHaiDe (Fujian) Industrial Equipment Co., Ltd., which is a well-developed equipment supplier in the field of automation in China currently. Our company has been established for 4 years, located in a rapidly developing coastal
Electronics Forum | Wed Aug 10 21:47:17 EDT 2005 | Geoff
Nihon superior could not provide any written aprovals but In asia.......... Sony- SN100C in use for car and home audio applications. Panasonic- SN100C in use for DVD, VCR, battery, and home appliances applications. Pioneer- SN100C in use for everythi
Electronics Forum | Tue Jun 27 10:30:54 EDT 2006 | russ
Aj, Did you switch from SN100C to the SACX? Russ
Used SMT Equipment | Board Cleaners
This equipment is located in our upcoming Nypro / Jabil Online Auction. Please select the below link for more details. https://bajabid.hibid.com/catalog/152818/nypro-february-2019-auction/
Used SMT Equipment | Soldering - Wave
Make: Speedline Technologies Model: Vectra Elite Vintage: 2006 Description: Wave Soldering Machine Notes: Lead-Free Includes Approx 1800 LBS SN100C 3 Bottom-Side Heaters 1 Top-Side Heater Condition: Complete & Operational Availability: May
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2022-10-24 08:01:58.0
I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that deliver high reliability. We also stand ready to work with customers in developing improved soldering materials and processes.Our objective is maximizing customer satisfaction by achieving the best possible quality and yield.
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Parts & Supplies | Pick and Place/Feeders
Air Filter Assembly LC1-M71A4-00X AIR FILTER F300-03 KG7-M8501-00x AIR FILTER F300-03 KG7-M8501-00X FILTER-AIR FILTER[AF40-04BC-A] HP04-000411A CP40 Air filter assy J1301175 AIR FILTER KG2-M8501-40X KE2010/KE2030 Head Air Filter E30527
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Parts & Supplies | Assembly Accessories
FUJI NRG1022 CAP FUJI NRG1040 NUT FUJI NRG1060 LOCK FUJI NRG1061 HOLDER, CAP FUJI NRG1070 CAP HOLDER FUJI NRG1072 HOLDER, CAP FUJI NRG1080 HOUSING FUJI NRG1081 HOUSING FUJI NRG1090 SPRING FUJI NRG1110 GUIDE FUJI NTB1830 BEARING THRUST
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2021-09-08 14:10:12.0
The Pb-Free Alloy Characterization Program sponsored by International Electronics Manufacturing Initiative (iNEMI) is conducting an extensive investigation using accelerated temperature cycling (ATC) to evaluate ball grid array (BGA) thermal fatigue performance of 12 commercial or developmental Sn based Pb-free solder alloys. This paper presents the initial findings from a specific subset of the temperature cycling test matrix. The focus is on comparing alloy performance for two of the most commonly specified temperature cycles, 0 to 100 °C and -40 to 125 °C.
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Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force
