Electronics Forum | Fri Apr 14 17:25:53 EDT 2006 | davef
As from previous discussions on this topic here on SMTnet, we are perfectly comfotable using leadfree component solderability protection on components with leaded solder, except BGA. Consider balling your BGA to be leaded.
Electronics Forum | Tue Apr 18 03:40:05 EDT 2006 | Slaine
Did you try tensile testing after thermal cycling? If there are any intermetalic problems between the two alloys this should show it.
Electronics Forum | Tue Jan 30 14:16:47 EST 2007 | CK Flip
Search the great archives: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10216&#Message40990
Electronics Forum | Fri May 04 12:18:46 EDT 2007 | ck_the_flip
For the mixed alloy scenario, here's something from the fine SMTNet archives: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10216&#Message40990
Electronics Forum | amol_kane |
Fri Apr 14 10:16:37 EDT 2006
Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir
Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind
Electronics Forum | Thu Aug 12 17:17:47 EDT 1999 | Brian Wycoff
| | | Does anyone use reflow profilers? Are they a good investement or is trial and error sufficient? | | | | | | Does anyone have any suggestions on profiles to try? Thanks. | | | | | Danielm | | I would hazard a guess that most if not all of us
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