Technical Library: 11.2 (Page 1 of 3)

Fine Tuning The Stencil Manufacturing Process and Other Stencil Printing Experiments

Technical Library | 2013-11-21 12:01:11.0

Previous experimentation on a highly miniaturized and densely populated SMT assembly revealed the optimum stencil alloy and flux-repellent coating for its stencil printing process. Production implementation of the materials that were identified in the study resulted in approximately 5% print yield improvement across all assemblies throughout the operation, validating the results of the initial tests. A new set of studies was launched to focus on the materials themselves, with the purpose of optimizing their performance on the assembly line (...) Results of the prior tests are reviewed, and the new test vehicle, experimental setup and results are presented and discussed.

Shea Engineering Services

Wave Solder Parameter Chart

Technical Library | 2006-05-13 13:07:53.0

This Excel Spreadsheet calculates the Wave Solder Contact Time automatically with given main Solder Wave width and Conveyor Speed. There is one chart where conveyor speed is expressed in meters/min and in another where it is expressed in feet/minute.

Jabil Circuit, Inc.

Void Detection in Large Solder Joints of Integrated Power Electronics

Technical Library | 2012-12-06 17:36:37.0

Inspection of integrated power electronics equals sophisticated test task. X-ray inspection based on 2D / 2.5D principles not utilizable. Full 3D inspection with adapted image capturing and reconstruction is necessary for test task.... First published in the 2012 IPC APEX EXPO technical conference proceedings.

GOEPEL Electronic

Quick Guide to Daisy Chain

Technical Library | 2000-11-13 20:28:58.0

Free 16 page booklet shows 200 standard SMD Daisy Chain configurations including BGA, QFP, TQFP, TSOP, SOIC, SSOP, Flat Pack, CERQUAD and more.

TopLine Dummy Components

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

Technical Library | 2012-10-18 21:58:51.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.

Agilent Technologies, Inc.

Optimized Stress Testing for Flexible Hybrid Electronics Designs

Technical Library | 2020-10-08 01:01:01.0

Flexible hybrid electronics (FHE) is emerging as a promising solution to combine the benefits of printed electronics and silicon technology. FHE has many high-impact potential areas, such as wearable applications, health monitoring, and soft robotics, due to its physical advantages, which include light weight, low cost and the ability conform to different shapes. However, physical deformations in the field can lead to significant testing and validation challenges. For example, designers must ensure that FHE devices continue to meet their specs even when the components experience stress due to bending. Hence, physical deformation, which is hard to emulate, has to be part of the test procedures for FHE devices. This paper is the first to analyze stress experience at different parts of FHE devices under different bending conditions. We develop a novel methodology to maximize the test coverage with minimum number of text vectors with the help of a mixed integer linear programming formulation. We validate the proposed approach using an FHE prototype and COMSOL Multiphysics simulations

Arizona State University

Design Rules For Selective Soldering Assemblies

Technical Library | 2018-02-14 22:58:54.0

This document describes general guidelines and attention points for PCB design regarding selective soldering. The guidelines can be applied for Select Wave and/or Multi Wave soldering process in both leaded and leadfree alloy. When a PCB is designed according to these guidelines, a stable and solid solder-process can be guaranteed.

Vitronics Soltec

Evaluation of Stencil Foil Materials, Suppliers and Coatings

Technical Library | 2011-12-08 17:46:42.0

The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c

Shea Engineering Services

Enclosed Media Printing as an Alternative to Metal Blades

Technical Library | 2015-08-06 19:17:53.0

Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself, traditionally the source of 70% of all assembly defects, finds its process window narrowing. The technology of metal blade squeegees, with the aid of new materials, understanding, and settings such as blade angle, has kept pace with all but the smallest applications, e.g., 200μ - .50 AR and 150μ - .375 AR, which have been pushing blade printing technology to its limits. Enclosed media print head technology has existed, and has been under increasing development, as an alternative to metal squeegee blade printing. Until recently, the performance of enclosed print heads had been comparable to the very best metal squeegees, but advances in enclosed print media technology have now made it a superior alternative to squeegee blades in virtually all applications.

Speedline Technologies, Inc.

Intermetallic Growth in Tin-Rich Solders

Technical Library | 2017-06-13 17:14:59.0

For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-

General Electric

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