Sales Manager: Sandy Lin Email: email@example.com Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Novastar GF12 Reflow Oven Equipment Description Novastar Model Number: GF-12HC/HT Serial Number: 1101232 Year 2011 Max Board Width: 12" Max Temperatute: 350C or 622F Heated Tunnel Length: 26" 3 Zones top, 3 Zones bottom Venting: 4" fla
Vintage: 12/2011 Details • Automated Paste Dispenser • GridLoc System • Laser Paste Bead Height Sensor • Contrast Based 2D Inspection (paste on pad)- • Triple Track Conveyor System (66" Track Length). With Servo Driven Vision X, Y
Industry News | 2011-05-16 15:29:22.0
Europlacer announces that it has been awarded a 2011 EM Asia Innovation Award in the category of Pick-and-Place Systems/Equipment (Low/Medium Volume) for its iineo–II VLB.
Industry News | 2011-04-20 17:36:31.0
MIRTEC, "The Global Leader in Inspection Technology", announces that it has been awarded a 2011 Circuits Assembly Service Excellence Award in the category of Electronics Suppliers — Test and Inspection for its outstanding customer ratings, as judged by its own customers.
Technical Library | 2018-02-01 00:31:48.0
This paper briefly summarizes the technologies underpinning the evolution in electrical system diagnosis and repair, which include schematic layout automation using prototypes and rule-based styling, instant language translation, 2D/3D view links with schematics, interactive diagnostic procedures, and dynamically-generated signal-tracing diagrams. These technologies empower after-sales service teams with state-of-the-art capabilities, which not only reduce costs but also improve brand quality in the eyes of its customers.
Technical Library | 2019-03-06 21:26:14.0
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However, variability in the mechanical properties such as the coefficient of thermal expansion and elastic modulus effects the material selection process by introducing uncertainty to the long term impacts on the reliability of the electronics. Typically, the main reliability issue is solder joint fatigue which accounts for a large amount of failures in electronic components. Therefore, it is necessary to understand the effect of polymer encapsulations (coatings, pottings and underfills) on the solder joints when predicting reliability.This paper presents the construction and validation of a thermo-mechanical tensile fatigue specimen. The thermal cycling range was matched with potting expansion properties in order to vary the magnitude of tensile stress imposed on solder joints
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