Electronics Forum | Wed Dec 11 12:07:33 EST 2019 | scotceltic
Our company has a spec on their current PCB dwg to make sure the fab house meets a specific thickness (min-max). The current spec reads: 13.5um min - 38.5um max. I assume it is to keep the board house honest and to make sure there is no exposed co
Electronics Forum | Mon May 19 09:29:59 EDT 2003 | bradlanger
Dave, We are using Kester Easy Profile 256 No clean Sn62Pb36Ag02. The oven itself is a Dima SMRO-0252 which is a short oven, it has 13" of preheat, 13.5" of soak, 6.25" of reflow, and 10" of cooling on the way out of the oven. We are soldering multi
Electronics Forum | Wed Feb 13 12:44:05 EST 2008 | ck_the_flip
Larry, from my days of working for a Telecom. company, Bellcore standards (now Telcordia) was our BGA Void guideline. There was some verbiage in the guideline that accounted for allowable VOID VOLUME ...keep in mind, VOID AREA and volume are 2 diffe
Electronics Forum | Mon Apr 16 10:55:01 EDT 2001 | genny
Happened at my company lots on our older designs. We touched up those pads in house by hand, because the solder joint was very poor. We also did it on SOT 86 pkgs on the gnd pins. When they were touched up, we would get an extra 1/2dB of gain out
Electronics Forum | Thu May 20 11:55:04 EDT 1999 | Parvez
hi everybody, We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the micr
Electronics Forum | Mon Jun 14 09:16:58 EDT 1999 | Adam Pratt
| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d
Electronics Forum | Thu May 20 22:42:19 EDT 1999 | Dave F
| hi everybody, | We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the
Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
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