Industry News | 2023-10-02 10:08:38.0
IPC Releases EMS Industry Results for August 2023
Industry News | 2011-10-03 17:11:11.0
IPC announced today the August findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2013-09-10 14:07:38.0
IPC announced the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and order growth both continued trending upward.
Industry News | 2014-03-18 10:25:24.0
The exhibit hall at IPC APEX EXPO® will host 440 companies showcasing new technologies, products, materials and services for the electronics manufacturing industry Tuesday, March 25 through Thursday, March 27, at Mandalay Bay Convention Center in Las Vegas.
Industry News | 2014-04-24 16:31:54.0
It was all business at IPC APEX EXPO® last month as 8,068 electronics manufacturing professionals from 47 countries converged at the Mandalay Bay Convention Center in Las Vegas.
Industry News | 2015-08-10 17:07:47.0
IPC announced the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders were up and the book-to-bill ratio strengthened to 1.06.
Industry News | 2010-07-29 15:13:21.0
Association Connecting Electronics Industries® announced the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2010-11-24 16:07:18.0
IPC announced today the October findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2019-05-20 18:51:08.0
SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste. Qualified by a third-party organization, the PQ10 series of low temperature solder paste is made with a modified Sn/Bi alloy that has a lower melting point range from 137°~142°C to 137°~170°C. This makes it ideal for SMT devices, which can have sensitive components that cannot withstand higher temperatures.
Industry News | 2019-04-15 06:42:26.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.
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