Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
Small but powerful reflow oven. 300 mm process width. Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m. 4 zone convection 300 mm sold
Electronics Forum | Wed Jul 16 11:54:25 EDT 2003 | MA/NY DDave
Hi, I agree with everyone else talk to the Mfg and ask for their recommended profiles. They should know the heating and the cooling profiles. If you really want to do this yourself you are going to have to run several experiments to determine just
Electronics Forum | Tue Jan 23 17:16:07 EST 2007 | darby
Check out the web sites of the major solder manufacturers. From a quick glance most of the pastes around that temperature range have problems with Zn content and may not be available as pastes???? Depending on your application, some of the lower melt
Features: Windows XP operation software with Chinese and English alternative available. whole system under integration control can analyze and display the failure. All production data can be saved completely and analyzed. PC& Siemens PLC cont
SMTmax reflow oven family of high-throughput thermal processing system is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. SMTmax F6 systems provide optimized lead-f
Industry News | 2018-08-09 12:24:23.0
Seika Machinery is pleased to announce that it carries six new process control devices from MALCOM and UNITECH. These include: SPS series paste mixers, viscometers, wetting balance testers, profilers / camera systems, reflow simulators and PCB board cleaners.
Industry News | 2017-08-26 20:31:21.0
Seika Machinery today announced plans to show the new Malcom SPS-2000 Solder Paste Mixer at SMTA International. This new version adds may new functions to make sure your paste is at its optimum condition for use.
SMT automatic solder paste mixer SMT automatic solder paste mixer PCB Depaneling Machine PCB Depaneling Machine, SMT PCB depanelizer Machine Manufacturer Pcb X Ray Pcb X Ray, SMT PCB Component Inspection Machine Manufacturer BGA X RAY Machine B
YVP XG X Y axis screw rod of kgj-m3130-00x printing press YVP XG X Y axis screw rod of kgj-m3130-00x printing press Moisture-Proof Cabine Moisture-Proof Cabine, SMD PCB And Components Storage Pcb Rack Pcb Rack, SMT Factory PCB Transport Trolley,
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Introduction to the Unitech UC-250M-CV PCB Cleaner. Multi-stage in-line bare PCB surface cleaner. Brush/vacuum, rubber roller/sticky paper, & Ionized air blower.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
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The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
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IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
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I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
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Programming, Operation, Maintenance,Troubleshooting of SMT machines. Programming of cyber optics/saki(AOI) Programmingn of pcb seperater Temperature profiling (Making & Soldering) Testing,Troubleshooting of microcontroller based PCAs
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured
Honreal solder paste mixer/smt solder paste mixing equipment_Honreal industrial Limited HOME ABOUT Company Profile Work shop Exhibition Honors Package Our Client PRODUCTS SMT Reflow Oven PCB Cutting
doesn’t need to wait for the solder paste to reach the same temperature of the working environment. The solder paste will be efficiently mixed within short time and be ready for use in the SMT printing