Industry News | 2018-10-15 18:51:46.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System and MS-11e 3D SPI Machine at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Nov. 14 - 15, 2018 at the Expo Guadalajara.
Industry News | 2016-07-18 16:56:22.0
The SMTA, iNEMI, and MEPTEC are pleased to announce the program for the 2016 Medical Electronics Symposium being held September 14-15, 2016 Marylhurst University near Portland, Oregon.
Industry News | 2022-05-05 17:16:31.0
The SMTA is pleased to announce the finalized technical program for the International Conference for Electronics Hardware Enabling Technologies. The in-person conference will take place June 14 - 15, 2022 at the Centennial College Event Centre in Toronto, Ontario, Canada.
Industry News | 2010-06-21 14:15:46.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine proudly announce that Bradley McCredie, Ph.D., IBM Fellow and Vice President of IBM Systems and Technology Group, will be the keynote speaker at the 7th Annual International Wafer-Level Packaging Conference being held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Dr. McCredie will present "Technology Scaling, Packaging, and Other Things That Might Put Our Kids Through College".
Industry News | 2015-09-16 10:52:46.0
IPC — Association Connecting Electronics Industries® will host this year’s Europe Forum: Innovation for Reliability in October in Essen, Germany. This three day event consists of two parts. The 9th Annual CALCE Tin Whiskers Symposium on 13 October, followed by the Technical Conference: Innovation for Reliability on 14-15 October.
Industry News | 2023-01-30 16:37:28.0
The SMTA is excited to announce the technical program for the Counterfeit Electronics & Materials Symposium. The symposium will be held 14-15 March 2023 at The Manufacturing Technology Centre in Ansty Park, Coventry, United Kingdom.
Industry News | 2019-10-03 14:15:15.0
SMTA announced Pete Lomas, FREng, Co-Founder and Hardware Designer of Raspberry Pi, will keynote the Advanced Electronics Assembly Conference on November 19, 2019 in Budapest, Hungary, and November 21, 2019 in Oradea, Romania.
Industry News | 2011-12-14 15:20:06.0
In January 2012, IPC will launch IPC Outlook, an electronic newsletter and Web portal for multimedia information about technology, standards, best practices and industry research. The new e-publication will focus on information that helps engineers and managers succeed in their jobs.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
