Technical Library: 1460 (Page 1 of 1)

Process Development And Characterization Of The Stencil Printing Process For Small Apertures

Technical Library | 2008-01-16 18:25:55.0

The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.

Speedline Technologies, Inc.

The Surface Finish Effect on the Creep Corrosion in PCB

Technical Library | 2012-05-10 19:48:10.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Creep corrosion normally happens in the end system, PCB, connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In thi

Integrated Service Technology (IST)

A Review of Test Methods and Classifications for Halogen-Free Soldering Materials

Technical Library | 2011-06-23 18:44:23.0

Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and refinement of the definition and testing of halogen-free solde

Indium Corporation

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