Industry News: 1460 (Page 1 of 2)

Parvus Unveils Three Fanless 800MHz Pentium III PC/104-Plus CPU Modules Designed for -40C to +85C Extended Temperature

Industry News | 2005-07-11 12:52:53.0

Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463

Parvus Corporation

Licensed Stencil Manufacturers Feature Florida CirTech’s NanoSlic Coating

Industry News | 2016-02-24 15:57:12.0

Introduced to the electronics market in 2014, NanoSlic is a proprietary thermoset polymer coating that renders metals, glass and polymers hydrophobic and oleophobic for improved protection and performance. FCT has developed not only the breakthrough chemistry, but also the equipment and application process that provide a turnkey stencil coating solution, NanoSlic Gold. Though used in multiple markets (www.nanoslic.com) for various safeguarding purposes, for electronics assembly applications, NanoSlic-coated stencils dramatically improve printing performance.

FCT ASSEMBLY, INC.

Henkel consolidates position in Fortune 500 ranking

Industry News | 2009-07-20 14:24:44.0

Henkel has made a gain of 20 places in the annual survey of the world’s 500 highest-revenue companies published by the US business magazine Fortune. In the overall ranking, Henkel holds position number 448 compared to 468 last year. And for the first time, Henkel has also gained entry this year in the list of companies making the biggest jump in profits, taking 36th place in that ranking.

ASM Assembly Systems (DEK)

Sustainability: Henkel’s leading position confirmed

Industry News | 2009-09-09 20:08:22.0

International consumer goods manufacturer Henkel has once again been included as a leader in its sector in the Dow Jones Sustainability World Index. The Index lists corporations that follow the principles of sustainable development in their business operations.

Henkel Electronic Materials

Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul

Industry News | 2009-04-09 22:35:29.0

The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.

Henkel Electronic Materials

Henkel Appoints Jim Wise to Lead Global Sales Efforts for Electronics Assembly Business

Industry News | 2009-05-20 19:48:38.0

In a move designed to further expand the company's market and sales leadership, Henkel Corporation has selected Mr. Jim Wise to direct the global sales effort for its electronics assembly business.

Henkel Electronic Materials

Henkel Launches New High-Temp Compatible Conductive Film for RF Grounding Applications

Industry News | 2009-06-08 23:35:30.0

Advancing the performance of electrically conductive film technology, Henkel has developed and launched Emerson & Cuming� CF3366�, a ground-breaking film technology that offers a robust alternative to traditional conductive materials.

Henkel Electronic Materials

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-28 12:23:26.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

ASM Assembly Systems (DEK)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-30 21:06:08.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

Henkel Electronic Materials

Henkel’s Pioneering Ablestik® Self-Filleting® Die Attach Receives Notice that First Patent to Grant

Industry News | 2009-09-09 20:07:33.0

Henkel Corporation today announced that the United States Patent and Trademark Office (USPTO) has allowed a patent covering its Ablestik® Self-Filleting® die attach products and controlled flow technique, which have been designed and perfected by the company over the past five years.

Henkel Electronic Materials

  1 2 Next

1460 searches for Companies, Equipment, Machines, Suppliers & Information

pcb assembly supplies

Orange Sticks, Wiring Aids & Probes for Soldering & Desoldering.
MSD Dry Cabinets

Best Reflow Oven


ONLINE IPC Training & Certification