Carrier and PCB Cooling Buffer for over 40 Products
Electronics Manufacturing Service Company that specializes in Integrity, Trust and Commitment to our customers success. Our capabilities in the latest SMT and Enclosure manufacturing, coupled with our design and marketing experience, makes us a comp
Electronics Forum | Fri Sep 07 16:26:34 EDT 2018 | m_imtiaz
thanks for your input
Electronics Forum | Fri Mar 12 16:26:37 EST 1999 | Nancy
Is anyone familiar with any of Manncorp used in Surface Mount Assembly?
Used SMT Equipment | Soldering - Reflow
Heller 1707 Mark III Reflow Oven Equipment Description Heller Model Number: 1707MK-III Serial Number: 0815N3-B7A2S-301451-05 Year 8/2015 Edge Rail and Mesh Belt Temperature: 350C Lead Free 7 Zones Top and Bottom Windows XP O/S Power: 208-
Used SMT Equipment | Soldering - Reflow
Very Nice Electrovert Reflow Oven For Sale! See attached pictures and information below Equipment Description Electrovert Reflow Oven Model Number: Omni 5 Serial Number: 05-1111871-01 Year 2001 Left to Right PCB Flow 5 Heating Zones Top an
Industry News | 2016-07-26 16:26:28.0
We are a full-service, SMT asset management organization with the primary objective of providing great personal service to both buyers and sellers. We have many years of direct experience in the electronics manufacturing and assembly industries.
Industry News | 2019-12-21 16:26:09.0
The following statement can be attributed to John Mitchell, president and CEO of IPC, a global electronics industry association:
Parts & Supplies | SMT Equipment
Cleaning device support block of DEK Printer
Parts & Supplies | SMT Equipment
YAMAHA YV100II 39 Nozzle Pls kindly contact with us at any time, if you are insterest more info about products. Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 What's app: 15629932323
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
Technical Library | 2019-03-15 16:26:50.0
While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation and networking, there is one aspect of production that remains stubbornly unaffected. Massive databases track everything from orders, to inventory, to personnel. CAD systems allow for interactive and dynamic 3D rendering and testing, digital troubleshooting, and simulation and analysis prior to mass production. Yet, with all of this computational power and all of this networking capability, one element of production has remained thoroughly and firmly planted in the past. Nearly all manufacturing or assembly procedures are created, deployed, and stored using methodologies derived from a set of assumptions that ceased to be relevant fifty years ago. This set of assumptions, referred to below as the “Paper Paradigm” has been, and continues as the dominant paradigm for manufacturing procedures to this day. It is time for a new paradigm, one that accounts for the vastly different technological landscape of this era, one that provides a simple, efficient interface, deep traceability, and dynamic response to rapidly changing economic forces.This paper seeks to present an alternative. Instead of enhancing and improving on systems that became irrelevant with the invention of a database, instead of propping up an outdated, outmoded and inefficient system with incremental improvements; rewrite the paradigm. Change the underlying assertions to more accurately reflect our current technological capability. Instead of relying on evolutionary improvements, it is time for a revolution in manufacturing instructions.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Career Center | San Jose, California USA | Management
Company: Ma Labs Job Title: Manufacturing Manager Headquartered in San Jose, as leading PC component distributor and DRAM & Flash products manufacturer worldwide, Ma Labs has specialized in memory modules since 1985. We provide a full range of memor
Career Center | Corpus Christi, Texas USA | Engineering,Production,Quality Control,Technical Support
Provides supervison of all Lab & Hi-rel Screening personnel along with Calibration and the Electronic Tech covering this area. Oversees all test procedures and documentation relative to testing. Works with customers and engineers as required. POSIT
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/news/innovative-dispensing-solutions-showcased-in-new-nordson-efd-catalog-5-26-16
Subscribe Blog Nordson EFD Home About Us News Innovative Dispensing Solutions Showcased in New Nordson EFD Catalog 5-26-16 Innovative Dispensing Solutions Showcased in New Nordson EFD Catalog 2016-05-26
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_2021_TrainingSchedule_LosAngeles.pdf
) Feb 19 May 21 Aug 27 Dec 10 J-STD-001 Certified IPC Trainer (CIT) Jan 25 - 29 Apr 12 - 16 Jul 26 - 30 Oct 18 - 22 Recertifications (Req. 24 mos
