Electronics Forum | Wed Feb 16 09:30:11 EST 2000 | MARK ALDER
Please refer to the archives on SMTNET date 02/19/1999 on aperture sizes for printing SMD adhesives. Regards Mark Alder
Electronics Forum | Tue Oct 04 05:01:00 EDT 2016 | ok66
Hello! Need help! We have Topaz Xi. Need to place QFP176 (26mm). When optimizing the error E0194 (Component will interfere with other nozzles). Need to turn off one nozzle, don't know how to do it. Сan You help us?
Electronics Forum | Tue Feb 15 06:12:20 EST 2000 | Dane Stokes
Also in some instances a 10% decrease on glue size would be needed for the smaller S.O.T. sizes out there. If you are dealing with a good company to make your screen they should send you back a preliminary art work file on the Screen to be made so yo
Electronics Forum | Wed Feb 16 21:05:06 EST 2000 | sin
Why don't you have stencil house make a selective wave fixture for your product so that you can avoid the glue problem. If it's a must for your process to have glue, you just add extra work and glue tended to contaminate. Just a suggestion..if you
Electronics Forum | Thu Mar 02 10:09:02 EST 2017 | rvines1
We have a board with an LQFP-176 with 0.5mm pitch. We regularly have to rework these due to unsoldered pins, which is due to pins that are slightly bent upward. We believe that we are receiving them this way, but it may also be due to handling on o
Electronics Forum | Fri Jan 10 03:57:37 EST 2020 | jakapratama
Hello, When I calculate based on the data you gave, your stencil aperture area compared to pad area is 94.52%. Your aperture area ratio is 1.76 using 5 mils thickness foil. OK, your stencil and your paste release is not the culprit here. Your proble
Electronics Forum | Mon Feb 14 12:39:41 EST 2000 | Dave F
Francois: Sound like a messy process to me. Choice #1: Put only SMT parts on the primary side Choice #2: Put only SMT parts on the primary and secondary sides Choice #3: Put only SMT and PTH parts on the primary side Choice #4: Put only SMT and
Electronics Forum | Tue Feb 15 13:16:02 EST 2000 | Rob Fischer
Don't feel alone. Many assemblers have the same problem but aren't fortunate enough to have say in the design of the board. They're either have a capital invedtment in a selective solder machine or pallets designed to mask bottom-side SMD. The pal
Electronics Forum | Thu Feb 17 10:14:40 EST 2000 | Jim N
We bulid many boards with fine pitch on solder side and then wave. We use a wave fixture that is custom for each board. The fixture covers the SMT components and only exposes the PTH lead during the wave process. It requires about .070 to .100" clear
Electronics Forum | Wed Apr 14 20:24:48 EDT 2004 | Ken
What do you mean the solder must "survive" 260C? What is your target temperature? Is it dictated by a component, the substrate or the solder alloy? Do you require a eutectic alloy? If not, the selection of alloys grows. (these are from memory...n
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