New SMT Equipment: 180 6,000 (20)

Fuji NXTⅡ Pick and Place Machine

Fuji NXTⅡ Pick and Place Machine

New Equipment | Pick & Place

Fuji NXTⅡ Pick and Place Machine Fuji NXTⅡ Pick and Place Machine H12S: 0402 ~ 7.5mm x 7.5mm H04: 6,000 cph 2MII Base:740 (L) x 1934 (W) Product description: Fuji NXTⅡ Pick and Place Machine, H12S: 0402 ~ 7.5mm x 7.5mm, H04: 6,000 cph, 2MII B

Kait High Tech Co.,ltd

Fuji Pick and Place Machine

Fuji Pick and Place Machine

New Equipment | Pick & Place

Fuji Pick and Place Machine Fuji NXTⅡ Pick and Place Machine H12S: 0402 ~ 7.5mm x 7.5mm H04: 6,000 cph 2MII Base:740 (L) x 1934 (W) Product description: Fuji Pick and Place Machine, H12S: 0402 ~ 7.5mm x 7.5mm, H04: 6,000 cph, 2MII Base:740 (L)

Flasonsmt Co.,ltd

Parts & Supplies: 180 6,000 (1)

Yamaha YS24 Track Mounter Table Y Axi

Yamaha YS24 Track Mounter Table Y Axi

Parts & Supplies | Assembly Accessories

YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 We also supply the below products: KHY-M71G5-A0 Z UNIT ASSY. YS12 Z-axis motor YG12 Z

KingFei SMT Tech

Technical Library: 180 6,000 (5)

An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

Technical Library | 2013-01-24 19:16:35.0

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.

Christopher Associates Inc.

New High-Performance Organophosphorus Flame Retardant

Technical Library | 2015-09-10 15:06:17.0

A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a broad range of resins including epoxy, polyolefin, and polyamide. The combination of excellent flame retardant efficiency, high thermal stability and exceptional electrical properties is unique to this organophosphorus flame retardant and makes it a breakthrough technology for high speed, high frequency use in fast growing wireless and wired infrastructures. Resin performance data, including formulations with synergists, are presented in this paper.

Albemarle Corporation

Express Newsletter: 180 6,000 (48)

Partner Websites: 180 6,000 (3)

Kapton Polymide Film

ORION Industries | http://orionindustries.com/pdfs/kapton.pdf

(0.87 N/cm), measured using an Instron-type tensile tester and a 180° peel. 3 Table 2 Mechanical Properties of Kapton Type HN Polyimide Film Property Value

ORION Industries


180 6,000 searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t net
  1 2 3 4 5 6 7 8 Next