Industry News | 2010-04-20 10:30:23.0
MADISON, AL — STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, has added the Heller 1913MKIII Convection Reflow/Curing Oven to its Microelectronics/Cleanroom.
Industry News | 2021-02-04 09:08:44.0
Growing Demand for Printed Circuit Board Assemblies Prompts Acquisition of New Equipment
Technical Library | 2017-02-16 16:53:49.0
This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.
HELLER 1809MKIII 1913MKIII Board T/C Digitizer Module TDM Heller Insustries Leave a Message We will call you back soon! Your message must be between 20-3,000 characters