Technical Library: 1913mkiii (Page 1 of 1)

Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders

Technical Library | 2017-02-16 16:53:49.0

This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.

Auburn University

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