Industry Directory | Manufacturer
China PCB manufacturer.Rigid,aluminium,FPC.1-12 layers,Min.line/space:0.1mm min.hole:0.1mm,burried and blind hole
Industry Directory | Manufacturer
Juivtmall is a PCB manufacture, produce normal PCB, FPC and HDI As for 2-layer, default property, the lead time will be 1 day. Ability of produce: Layer: 2-64 layers Min drill: 0.1mm Min trace/spacing: 1.57mil 2+N+2, 3+N+3......
Refurbished Yamaha YV100X Pick and Place Machine MC Type YV100X PCB size L460 x W445 mm (Max.), L50 x W50 mm (Min.)or L460 x W335 mm Accuracy +-0.1 mm(Chips), +-0.08 mm Mounting Speed 0.198 sec/chips
New Equipment | Rework & Repair Equipment
A great entry level BGA Rework Station for jobs that don't require split vision assist camera. Features: 800 Watt Upper Component Heater 1200 Watt Lower Component Heater 2700 Ceramic PCB Area Under Heater Fit boards up to 15" Wide Pl
Electronics Forum | Fri Oct 29 09:34:48 EDT 2004 | glaucon
See attached link, I've used this in the past. http://www.efd-inc.com/
Electronics Forum | Fri Oct 29 07:35:42 EDT 2004 | Paddy
Hello all, I am looking at doing some trials with underfill under 1mm pitch BGA devices. Can anybody share any good / bad experience with this process ? Also I probably will not be in a position to procure automated equipment so are there any man
Used SMT Equipment | SMT Equipment
Name:YV112-III Placement Speed: 14000cph(0.26sec/chip) Placement Station:100 PCB Dimensions: 460*440 Accuracy: ±0.1mm Power Supply: 3PH,200-415V ,3KVA Machine Dimensions: 1600*1400*1800 Weight: 1300kg
Used SMT Equipment | SMT Equipment
Name: YV88ll Placement Speed: 9000cph(0.40sec/chip) Placement Station:100 PCB Dimensions: 330*250 Accuracy: ±0.1mm Power Supply: 3PH,200-415V,3KVA Machine Dimensions: 1650*1358*1810 Weight: 1300kg
Industry News | 2003-06-17 08:07:40.0
The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.
Industry News | 2017-10-17 19:32:15.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System in Hall A2, Booth 329 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Additionally, the company will show the MS-11e 3D SPI, MV-3 OMNI Desktop 3D AOI and INTELLISYS® software.
Parts & Supplies | Screen Printers
DEK belt (122022/G4957) More SMT belts available (Can be customized according to customer requirements) 300-5GT-23 Original belt 300-S5M-20 Original belt 460-5GT-12 Original belt 580-5GT-22 Original belt 00329739-01 Siemens Original belt H45
Parts & Supplies | Screen Printers
DEK stencil rope (177055) More SMT belts available (Can be customized according to customer requirements) 300-5GT-23 Original belt 300-S5M-20 Original belt 460-5GT-12 Original belt 580-5GT-22 Original belt 00329739-01 Siemens Original bel
Technical Library | 1999-05-07 08:50:40.0
To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Suitable for cutting all kinds of PCB boards with V-cut, SMT circuit boards, aluminum boards, LED circuit boards, LED strips. Mainly used in the LED, SMT, mobile phone / mp3, electric toy, various electronic . please feel free to contact email addr
Suitable for cutting all kinds of PCB boards with V-cut, SMT circuit boards, aluminum boards, LED circuit boards, LED strips. Mainly used in the LED, SMT, mobile phone / mp3, electric toy, various electronic . please feel free to contact email addr
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
| https://www.feedersupplier.com/sale-13067538-smt-machine-parts-1mm-yamaha-label-feeder-stainless-steel.html
SMT Machine Parts 1mm Yamaha Label Feeder Stainless Steel Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.wesource.com/miscellaneous/mist-catcher-mini-1mm-100-1bmm-100-id-001232/
Mist Catcher Mini 1mm-100 1BMM-100 ID_001232: World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US: 858.693.1991 Home About Us Contact Us Categories AOI Assembleon Machines Assembleon Parts Batch Ovens and Chambers Component Counters/Tapers Component Placers