New Equipment | Board Handling - Conveyors
PCB reject conveyor and PCB conveyor and SMT reject conveyor from ASCEN allows PCB printed circuit board manufacturers to easilly isolate bad or reject boards from SMT production line,PCB board rejection is based on up-line process input, typically p
New Equipment | Cleaning Equipment
QYSMT / MOREL Automatick Ultrasonic Stencil Cleaner BMP-1200 Features: ▶All stainless steel body: beautiful, wear resistance, corrosion resistance, acid, alkaline and other cleaning fluid. Meet environmental protection requirements and standards
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Parts & Supplies | Circuit Board Assembly Products
PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
PCB reject conveyor/AOI rework conveyor/NG PCB conveyor/NG reject conveyor, link:https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/130.html PCB reject conveyor is designed for good/bad PCB separation. It can also be used when visua
1.5M LED board conveyor|PCB linking conveyor|PCB inspection station for SMT assemblyhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/177.html ASCEN major for the PCB conveyor and the PCB magazine loader &unloader,PCB depaneling mac
Training Courses | ONLINE | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Career Center | , | 2013-01-31 04:45:28.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
SMTnet Express, November 7, 2019, Subscribers: 32,325, Companies: 10,919, Users: 25,284 Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor Credits: Power Electronic Systems Laboratory (PES) Inductors
| https://www.wesource.com/miscellaneous/lapmaster-wolters-12-bench-top-lapping/polishing-id-140378/
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Whizz Systems | https://www.whizzsystems.com/ic-package-design/
(like compact in size, faster, reliable, cost effective, consumes less power and quick switcher) as compare with the discrete circuits
