Qualitek has developed a unique no clean flux system designed specifically for high temperature lead free alloys. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type. NC600 exhibits virtually no
Lead free water-soluble wire solder. Provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. WS700 exhibits virtually no spattering. WS700 conforms to J-STD-004, ORH1. Main Features Excellent wettability
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 Bare board final surface finish Ions Hot air solder level OSP over copper Gold over nickel Chloride 0.75 ug/cm^2 0.75 ug/cm^2
Industry News | 2017-11-08 15:17:48.0
Nordson ASYMTEK will introduce a powerful array of new products, technologies, and solutions for conformal coating and automated fluid dispensing at Productronica 2017 in Hall A2, stand 345.
Industry News | 2018-08-09 12:24:23.0
Seika Machinery is pleased to announce that it carries six new process control devices from MALCOM and UNITECH. These include: SPS series paste mixers, viscometers, wetting balance testers, profilers / camera systems, reflow simulators and PCB board cleaners.
SAMSUNG CP45 KOGANEI A040-4E1-64W VALVE 0.2-0.7MPa
Detailed Product Description Brand: Ipulse Part Name: Nozzle Model: K05 Size: ø3.0 / ø2.0 Machine Model: FV7100 Origin: China Ipulse K05 Nozzle Size ø3.0 / ø2.0 For FV7100 Machine Black Material Description: 1, Part Name: Nozzle 2, Model:
Technical Library | 2009-09-18 14:42:37.0
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Training Courses | ONLINE | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Events Calendar | Tue Apr 19 08:30:00 EDT 2016 - Tue Apr 19 17:00:00 EDT 2016 | Kista, Sweden
Control of Signal Integrity and Crosstalk with Richard Hartley
Career Center | Toronto, Ontario Canada | Engineering,Production,Purchasing,Sales/Marketing
A dedicated professional with 17+ years of experience in product management, marketing, project management, engineering and manufacturing. Demonstrated ability to interact with customers and manage cross-functional teams to drive business growth. 4+
: 25 °C, 1000 Hz 0.0029 0.0032 0.0022 0.0022 k. A. k. A. k. A. 0.0027 k. A. 0.0019 Volumenwiderstand: Ohm-cm 1,65 x 10^14 1,0 x 10^13 2,0 x 10^15 2,0 x 10^15 Überstrom Überstrom Überstrom 2,15 x 10^15 Überstrom 7,28 x 10^13 Betriebstemperatur
≥2,0 mit einer Nassdruckgenauigkeit von ±17 μm @ 6 Sigma, Cpk ≥2,0. Engere Leistungstoleranzen bedeuten höhere Wiederholbarkeit mit weniger Defekten