New SMT Equipment: 2,3 rh2 (10)

FOXBORO FBM219 Voltage Monitor Invensys Process System PLC Termination Assy

FOXBORO FBM219 Voltage Monitor Invensys Process System PLC Termination Assy

New Equipment | Industrial Automation

Product display     Product highlights Brand new and original in box--2-3 days against the payment --1 Year Warranty-- Full Tested -- Worldwide Shipping -- Good  Service.. Emergency Shipping   How to Contact u

Cambia Automation Limited

C87-11006★★ABB★★sales6@amikon.cn

C87-11006★★ABB★★sales6@amikon.cn

New Equipment | Other

Contact :Jim(Sales Manager) ★Mobile(WhatsApp): 86-18020776782 ★Email: sales6@amikon.cn ★Skype:live:sapphire_264 ABB C87-11006 Promiss 100% full New - Original Factory Seal Warranty: 12 months Package: Original packing with cartons Payme

Create New Trade Company

Parts & Supplies: 2,3 rh2 (2)

Panasonic Rl131 Lever (N610082093AA)

Panasonic Rl131 Lever (N610082093AA)

Parts & Supplies | Pick and Place/Feeders

Product Description We supply Panasonic/TDK/ Universal machine AI spare parts original new and copy new all have, welcome to inquiry. I)Panasonic Machines: AVF, AVK, AVK2, AVK3, AVK2B, AVF, AVB, JV, JVK, JVK2, JVK3, RHS2B, RHS2, RHS, RH5, RH3, RH

ZK Electronic Technology Co., Limited

Panasonic AI Parts X004-352-2 X004-387

Panasonic AI Parts X004-352-2 X004-387

Parts & Supplies | Other Equipment

AI Parts X004-352-2 X004-387 we supply PANASONIC AI machine all spare parts:avf,avk,avk2,avk3,avk2b,avf,avb,jv,jvk,jvk2,jvk3,rhs2b,rhs2,rhs,rh5,rh3,rh2,rhu2,rhu,rh6,rh,rh6b,rhb,RL131,original new and copy new all have ,welcome to inquiry.

Jinchen Electric Technology Co,.Ltd

Technical Library: 2,3 rh2 (2)

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Technical Library | 2010-01-06 22:27:03.0

Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.

Henkel Electronic Materials

The Surface Finish Effect on the Creep Corrosion in PCB

Technical Library | 2012-05-10 19:48:10.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Creep corrosion normally happens in the end system, PCB, connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In thi

Integrated Service Technology (IST)

Express Newsletter: 2,3 rh2 (26)

Validity of the IPC R.O.S.E. Method 2.3.25 Researched

Validity of the IPC R.O.S.E. Method 2.3.25 Researched Validity of the IPC R.O.S.E. Method 2.3.25 Researched This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from


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fluid dispenser

ETM Auction - 1 of 3 Starts Sep 28, 2021 at 6 AM PDT • Closing Sep 30, 2021 at 11 AM
fluid dispensing pumps for integration

High Precision Fluid Dispensers
pcb assembly supplies

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...


High Speed Precision In-Line SPI System - Mirtec MS-11
BGA and SMD Rework Stations