Industry Directory | Consultant / Service Provider
G2 provides a complete, integrated, cloud-based solution that increases manufacturers' visibility, control and recovery of revenue.
Industry Directory | Consultant / Service Provider / Manufacturer
As an one-stop service provider of PCB, Sophic is especially specialized in medium volume to mass production of 2-10 layers rigid board. Sophic has been certified by ISO9001, UL and TS16949.
ASCEN PCB cutting machine ASC-620 model can separate PCB board with high component placed close to the edge can be separated safety, with minimum internal stress, especially suitable to separation of precise SMD or thin board. Unlike double roun
Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable solutions for today's electronic devices. As a result, companies in the surface mount technology (SMT) industry are expanding the
Electronics Forum | Thu Oct 16 10:56:23 EDT 2003 | james
We received some parts from our stores room with out a part number. We have 2 to choose from one being a 5% and one being a .1%. Does the color of the resistor mean anything? Just need some help on this. Thanks.
Electronics Forum | Mon Apr 13 18:18:31 EDT 2020 | wbrenner
Does any one have a general cost percent going from class 2 to class 3 for the same Assembly.. Or, general up charge percent when biding class 2 vs class 3?
Used SMT Equipment | General Purpose Equipment
Branson Ultrasonic Degreaser For Sale Good Working Condition See attached pictures and information below Equipment Description Branson Model: BSD-1216 Stainless Steel Construction 100 percent free board 22 Gallon Solvent Capacity (2) W
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Industry News | 2003-02-05 09:14:02.0
The Event will be Held in the Wyndham San Jose Hotel on February 20, 2003
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Events Calendar | Tue Mar 12 00:00:00 EDT 2019 - Thu Mar 14 00:00:00 EDT 2019 | Munich, Germany
LOPEC 2019 - 11th International Exhibition for the Printed Electronics Industry
Career Center | Houston, Texas USA | Engineering,Management,Production
SMT Manufacturing Engineer – 2nd Shift Hunting Innova is a Houston based company serving industrial, energy, medical, defense and aerospace segments of the Electronic Manufacturing Services (EMS) Industry since 1989. Hunting Innova is located in N
Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support
CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR
Career Center | Los Gatos, California | Management,Sales/Marketing
Seasoned sales professional skilled in both direct sales and sales management. Recognized for polished communication, negotiation, and problem-solving skills, Excelled in positions where a combination of direct sales and channel sales force developm
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 33, (#ts#)) SMT Express, Volume 2, Issue No. 11 - from SMTnet.com Volume 2, Issue No. 11 Friday, November 17, 2000
| https://www.eptac.com/category/upcoming-webinars/shown.bs.collapse/page/6/__/ais-highlight__/-27.7%25/page/2/__/ais-highlight__/-36.868%25/129.432%25/129.432%25/129.432%25/page/2/
Page 2 – EPTAC – Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/news-releases/nordson-corporation-board-of-directors-declare-2-for-1-stock-split
Split 2011-03-01 Westlake, Ohio, USA – March 1, 2011 - Nordson Corporation (Nasdaq: NDSN) announced today that its board of directors has declared a 2-for-1 stock split, in the form of a 100-percent stock dividend, effective April 12, 2011 for all shares outstanding at the close of business on March 25, 2011
