Industry Directory | Consultant / Service Provider / Manufacturer
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Electronics Forum | Fri May 02 09:49:19 EDT 2003 | tommyg_fla
3NaH2PO3 + H2SO4 + 2H2 + Ni^0 Potassium is co-deposited with the nickel, as follows: H2PO2^- + Hads => H2O + OH^- + P 3H2PO2^- + P => H2PO3^- + H2O + 2OH^- What is Hads?
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
Used SMT Equipment | Soldering - Reflow
13 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane, Gen 5.2, OMS
Used SMT Equipment | General Purpose Equipment
More information: https://bajabid.com/product/despatch-lac2-12-2-environmental-chamber/ This machine is avalable for immediate purchase. Please contact us with any interest. (813) 992-2437
Industry News | 2013-01-04 15:59:09.0
04 Jan 2013 Heller Industries Shanghai will be celebrating its 10th year of operation on Jan 31, 2013.
Industry News | 2019-09-12 22:51:52.0
Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.
Parts & Supplies | Pick and Place/Feeders
This item is included in the August 21-24 Online Auction. Please visit the following website for all of the details. http://bajabid.hibid.com/catalog/108607/august-2017-online-auction/?cpage=2
Parts & Supplies | Pick and Place/Feeders
The following items are being sold in Baja Bid's upcoming online auction. Auction Dates, June 7 – 9, 2021 Preview, June 2, 2021 Auction Opening, June 7 [8:00 am EST] Auction Closes, June 9 [1:00 pm EST] Checkout, June 10 – 24 20
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Wed Jul 19 00:00:00 EDT 2023 - Wed Jul 19 00:00:00 EDT 2023 | Shanghai, China
China East Technology Conference
Events Calendar | Wed Jul 19 00:00:00 EDT 2023 - Wed Jul 19 00:00:00 EDT 2023 | ,
China East Technology Conference
Career Center | bargain face-to-face, California USA | Engineering,Maintenance,Sales/Marketing,Technical Support
I.C.T Global Localization Recruitment | Join Our Team Today! We are actively seeking talented individuals from around the world to join our team. Take a look at the following positions available: 1. Senior SMT Engineer: 3 people 2. SMT Service E
Career Center | All over the world, Alabama USA | Engineering
2023 is the year for I.C.T's global localization strategy, and we are seeking talented individuals worldwide for the following positions. I.C.T adheres to the principles of "Simple, Open, Undertake, Coordination and Share" to build a pl
Career Center | Palghat, Kerala India | Management,Production
SUMMARY Two years of experience in telecommunication industry dedicated in manufacturing Electronic Push Button Telephones and Six months of experience in surgical industry dedicated in manufacturing Surgical Absorbent Cotton Wool. Presently wo
Career Center | Tirupati, India | Engineering,Production
2 YEARS EXPERIENCE ON NEOLYNC IN EQUIPMENT INCHARGE
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 11, (#ts#)) SMT Express, Volume 2, Issue No. 2 - from SMTnet.com Volume 2, Issue No. 2 Thursday, February 17, 2000
| https://www.eptac.com/faqs/soldertips/page/2
Soldertips (2) Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_test_xray_agilent.html
HP3070-2 Agilent Technologies HP 3070 Series 2 Fully upgraded to Series 3 With ergonomic arm, flat screen and fan cages (18) 6mHZ dd cards (2) Control XT (2) ASRU”C (2) 6624 PS (1) Self Test fixture Software Spares Manuals Price
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