For laser marking and engraving of PCB’s. Can engrave up to 16 characters and two dimensional code. We offer three fully automated marking systems: ZK-G-300 Green Laser ZK-UV-300 UV Laser ZK-co2-10 co2 Laser These systems are in line units and
DESCRIPTION IC697PWR711 GE Fanuc PLC Series 90-70 IC697PWR711 GE Fanuc PLC Series 90-70 1785-L40B Revisions: Ser A Ser B Ser C Ser D Ser E Description: Allen Bradley PLC 5 PLC-5/40 Standard Processor, 2048 Max Analog I/O, 48 Kilowords,
Electronics Forum | Fri Jul 23 04:29:38 EDT 1999 | MK
Can anybody recommend low capacity PCB manufacturing equipment for labaratory or research/designers center. Output 2-10 sqr. m. per shift; required working space 30-100 sqr. m. Spent too much time looking fr this. Thanks in advance.
Industry News | 2013-03-04 16:08:13.0
IPC and the industry, Karen McConnell, Northrop Grumman, and Linda Woody, Lockheed Martin, earned IPC Presidents Awards at IPC APEX EXPO® in San Diego.
Industry News | 2010-04-22 17:10:39.0
NASHVILLE — Kyzen, the world leading provider of environmentally responsible cleaning products for high reliability and high-technology manufacturing operations, announces that Charlie Pitarys, Sales Technical Manager, will hold a presentation titled “Cleaner Selection Simplified” at the upcoming Process Cleaning Expo, scheduled to take place May 4-6, 2010 at the Kentucky International Convention Center in Louisville, KY.
Long term spot supply: Samsung's original new SM/CP Feeder: 8 * 2mm 8 * 4mm 12mm 16mm 24mm 32mm 44mm 56mm Samsung original new SME Feeder: 8mm -56mm Samsung original new TN suction: TN040 TN065 TN140 TN220 TN400 TN400N TN750 TN1100 Samsung or
Device description: Machine Model: NXT-M3 Machine year: 2007 PCB Size: Minimum: 48mm X 48mm Max: 510mm X 534mm(dual track) Patch speed: H12HS: 22,500; H08:10,500; H04:6,500; H01:4,200 Paste accuracy: H12S/H08 / H04 :0.05 mm(3sigma) cpk ≥ 1.00 T
Technical Library | 2020-04-14 16:00:20.0
The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
40001096 CENTERING PIN 2.5 40001097 CENTERING PIN 2.0 40001098 CENTERING PIN 1.9 40001099 CENTERING PIN 1.8 40001109 MNLA HEAD ASM. 40001110 MNLA HEAD BRACKET AS 40001113 T PULLEY 1 40001114 T PULLEY 2 E86887000A0 LED PS PWB ASM E8688700
Pick and Place Systems Overview - Nordson Product Solutions Nordson Corporation Global Directory Languages NASDAQ $209.20 -2.10 Our Products Our Industries Our Applications Brands
länger so bleibt wie am ersten Tag. Technical Article Sustainable Cleaning With Soil Release Polymers EN (2.10 MB) Datei herunterladen Schliessen Bitte geben Sie Ihre Kontaktdaten ein