Electronics Forum: 2.25 (Page 1 of 23)

Connector PAD no solder

Electronics Forum | Mon Jun 26 00:22:26 EDT 2006 | YQ Deng

Through the pads of conncector(50pin) were printed full solder paste, the solder paste of about 2-5 pads follow to bottom of the connector 2-5 pins, the 2-5 pads outside of connector no any tin after reflow. Is this PCB problem? I can supply failur

Fuji CP4 & 0402

Electronics Forum | Fri Feb 01 05:42:21 EST 2008 | aj

Hi all, Is anyone out there placing 0402 with a CP4? Not sure how reliable it would be and also how do work around the nozzle setup ? we currently have 2.5mm ,1.3mm & 1.0mm so do you remove say 6 x 2.5mm and put in 0.7mm. Any replies appreciated.

Modify radial machine pitch from 2.5 to 3.5 pitch

Electronics Forum | Sun Jun 16 08:00:51 EDT 2013 | zaldytorres

Does anyone have suggestion how to modify radial insertion machine to 3.5mm pitch? I have to insert 3.5mm pitch Ecap but the industry standard radial machine could mount only 2.5 or 5 mm pitch. changing PCB or parts is not an option as it is not appr

automatic insertion of radial components 3.5mm

Electronics Forum | Mon Aug 20 15:53:52 EDT 2007 | erhard

Manufacturing already tried to get a design change but no chance. I guess because the designer is afraid the components could get bent too much if they are mounted with a stand off. Of course everyone who has to manufacture this fist sais: why don't

Stencil Aperture Size vs Copper Pad Size

Electronics Forum | Mon Aug 08 18:59:49 EDT 2016 | oleksz

What should be solder paste stencil aperture proper size in comparison with PCB copper pad for lead free technology? When designing PCB foortprints I was using solder paste pad undersize of 2.5 mils (0.06mm) per side (solder paste pad size was 2.5 m

Replacement IP2 nozzles/feeders

Electronics Forum | Mon Jul 26 14:16:54 EDT 2010 | jdengler

I don't find this P/N in my list of 2.5mm IP2 nozzles. But we buy from and have bad nozzles repaired by SMT Researh. www.smtresearch.com Jerry

Re: BGA problem: open after reflow

Electronics Forum | Thu Nov 02 22:11:46 EST 2000 | Dason C

Please check with Fab house, what is the thickness of the immersion gold if the gold thicknesss is less than say 2.5 micron, you will found dewetting or open. It is recommend the gold thickness is around 5 micron. Good Luck Dason

Humidity of SMT component storage environment.

Electronics Forum | Mon Jan 22 21:24:33 EST 2001 | edger_w

Hi! Mike My company is using the electric dry box and it can controlled less than 10% within 2.5 hours if we are not going to open the door. In normal working environment and it still can't control around 30%. Is it something that you are looking

Bottom side process question

Electronics Forum | Fri Mar 16 15:52:22 EST 2001 | blnorman

We screen print epoxy adhesive, place components then run the board through our adhesive oven (2-5 min cure at 150�C). This is in addition to reflow.

ekra x5 smema question

Electronics Forum | Fri Apr 01 07:38:52 EST 2005 | bobpan

The machine has 2 25 pin cables that are supplied with it and you have to have adapters that plug into them for smema or siemens. The cables are x20 and x21 smema pigtails.

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