Electronics Forum: 2.5.5 (Page 1 of 1)

LED (Ligth Emitting Diode) auto insertion equipment

Electronics Forum | Tue Nov 11 08:08:43 EST 2003 | Chris

Use a Radial lead inserter. you will need 1 head for each different part number you have. the machine cannsert 2.5 $ 5.o mm lead components and 7.5 with special to0ling. For LED you want to use a Radial with the new dual spocket CTA (Component transf

IPC-A-610D Question

Electronics Forum | Tue May 02 14:56:57 EDT 2006 | Tim

8.2.5.5 Flat Ribbon, L, and Gull Wing Leads, Maximum Heel Fillet Height (E). For class 3 the heel fillet cannot touch the body of a plastic component, except for SOICs and SOTs. Why is my question? What type of failure will be the result of solder

ENIG

Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70

Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de

Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - Cross Sectioned)

Electronics Forum | Mon Apr 28 15:20:50 EDT 2014 | davef

Your customer is correct. Your supplier has clamped some sort of machine to your butt and has plugged it in the wall outlet. Honest mistake: * IPC-A-600H, 3.3.2 Lifted Lands - (Cross Sections) ... pertains to boards that were cross sectioned after t

assembly cleanliness and ionic testing

Electronics Forum | Thu Feb 12 11:57:59 EST 2009 | jmiller

i have searched the forum for hours. read all the threads that deals with cleanliness and ionic testing. (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=40295) (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=22603) (http://www.

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