Electronics Forum: 2.re (Page 1 of 1)

Re: Plastic BGA

Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc

Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity

BGA failure when chamber test

Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta

Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the

Temperature Profiling

Electronics Forum | Thu Dec 10 19:15:07 EST 2009 | swag

We like to keep one fully populated SMT golden per product (high volume) with t-couples soldered to it. We have best results using high temp. solder to attach t-couples (most permanent). 1) Remove all production solder from the part you are wanting


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