Technical Library: 20

Reliable Selective Soldering For High Volume Assemblies

Technical Library | 2020-04-14 16:00:20.0

The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products.

ITW EAE

Recycling of Non-metallic Residue from Waste Printed Circuit Boards to Produce Interlocking Concrete Blocks

Technical Library | 2022-01-05 23:14:20.0

The process of copper recovery from waste printed circuit board has generated large amounts of non-metallic fraction (NMF) residue. In this research, the residue was recycled as a substitute for fine aggregates at 0%, 5%, 10%, 15%, and 20% to produce interlocking concrete blocks. Properties of the interlocking concrete blocks produced in this study, such as density, water absorption, compressive strength, were firstly examined and the selected mixes were further evaluated for the heavy metal leachability.

Mahidol University

Manufacturing Operations System Design and Analysis

Technical Library | 1999-05-06 14:48:20.0

This paper describes manufacturing operations design and analysis at Intel. The complexities and forces of both the market and the manufacturing process combine to make the development of improved semiconductor fabrication manufacturing strategies (like lot dispatching, micro and macro scheduling policies, labor utilization, layout, etc.) particularly important...

Intel Corporation

Printed Electronics for Medical Devices

Technical Library | 2020-11-10 15:50:20.0

As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a "smart" transformation. This has driven the development of medical devices that provide greater access to in-home care and monitoring and faster results for medical professionals, with the overarching benefit of better patient outcomes. Devices applied to the human body that commonly sense

Henkel Electronic Materials

Printed Circuit Board Quality: Copper Wrap

Technical Library | 2021-07-20 20:12:20.0

Motivation: High reject rates for PCBs due to specification non-conformances Multiple rebuilds causing impactful schedule delays + Copper Wrap + Wicking + Etchback + Annular Ring Are rejected boards reliable? What are PCB quality requirements for? + Reliability: fewer cycles-to-failure? + Manufacturability: define threshold of modern manufacturing capability?

NASA Office Of Safety And Mission Assurance

Failure Analysis

Technical Library | 2021-09-15 18:44:20.0

Analyzing failures is a critical process in determining the physical root causes of problems. The process is complex, draws upon many different technical disciplines, and uses a variety of observation, inspection, and laboratory techniques. One of the key factors in properly performing a failure analysis is keeping an open mind while examining and analyzing the evidence to foster a clear, unbiased perspective of the failure.

ASM International

Different Types of Pressure Transmitters, Working Principle, and How to Select Pressure Transmitter

Technical Library | 2021-11-25 01:24:20.0

Pressure transmitter is a kind of pressure measuring instrument widely used in many transmitters. It is widely used in petroleum, chemical, metallurgy, food, electric power, medicine, papermaking, textile and other industries. It is mainly used to detect the differential pressure, pressure, absolute pressure and liquid level of fluid.

OKmarts Industrial Parts Mall

A Novel High Thermal Conductive Underfill For Flip Chip Appliation

Technical Library | 2014-02-27 15:30:20.0

Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices

YINCAE Advanced Materials, LLC.

What is usage of Electronic dry cabinet?

Technical Library | 2019-08-19 23:55:20.0

Electronic dry cabinet for MSD storage Humidity is one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase production efficiency and save cost. In semiconductor and electronic industry, the key section of rejected products mostly happen during SMT heating process, Climatest Symor® auto dry cabinet is a superior solution to avoid the cracking. Warranty: two years with lifetime technical support

Symor Instrument Equipment Co.,Ltd

Automated Inspection Of PCB Components Using A Genetic Algorithm Template-Matching Approach

Technical Library | 2021-04-15 14:44:20.0

Automated inspection of surface mount PCB boards is a requirement to assure quality and to reduce manufacturing scrap costs and rework. This paper investigates methodologies for locating and identifying multiple objects in images used for surface mount device inspection. One of the main challenges for surface mount device inspection is component placement inspection.

Springer-Verlag

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20,0 searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

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Pillarhouse USA for handload Selective Soldering Needs

High Throughput Reflow Oven
thru hole soldering and selective soldering needs

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SMT spare parts

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