New SMT Equipment: 20-25 (426)

MALCOM Reflow Profilers

MALCOM Reflow Profilers

New Equipment | Reflow

Malcom Reflow Profilers have been indispensable to the temperature management of reflow ovens. Smaller and lighter than previous models, new functions are also incorporated into the newest version. Models: RCP-600 Reflow Profiler RCR-60 Wireless

Seika Machinery, Inc.

Lowering Gate Conveyor Series

Lowering Gate Conveyor Series

New Equipment | Board Handling - Conveyors

This unit is used when a passage way is required in a production line.


Electronics Forum: 20-25 (81)

Voids in solder fillet

Electronics Forum | Thu Apr 17 16:41:37 EDT 2003 | davef

60% 36% of ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept Reject 30% of ball diameter >30% 09% of ball area >09%

Solder Paste Thickness Measuring Device

Electronics Forum | Thu Mar 18 14:20:25 EST 2004 | pjc

here's another:

Used SMT Equipment: 20-25 (21)



Used SMT Equipment | AOI / Automated Optical Inspection

Large PCB manual included center board supports and J-Lead options Hardware Specifications Image Signal Input Unit * Video Camera: Triple Element CCD Camera * Light Source: 3-Ring-Shaped Fluorescent Lamps with automatic brightness control

Capital Equipment Exchange

Panasonic BM231

Panasonic BM231

Used SMT Equipment | SMD Placement Machines

  ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand: CP40L; CP40LV; CP45F; CP45FV;  CP45FVneo); YAMAHA SMT mac

Shenzhen ETA Technology Co., Ltd

Industry News: 20-25 (26)

Europlacer Completes Strongest Year Since 1998

Industry News | 2012-01-05 20:25:01.0

Europlacer reports its strongest financial results since the market boom of the late 1990s.


Europlacer Expansion Continues with New Distributor in Poland.

Industry News | 2016-07-27 20:25:41.0

Pick & place equipment manufacturer Europlacer has appointed PAKT Electronics as its exclusive distributor in Poland. Formed in 2008, PAKT is well connected across the country and represents other principals in the territory, offering capital equipment, peripherals and consumables.


Parts & Supplies: 20-25 (88)

TDK AI PART 615-05-133 Koganei DA 20*25-3001W for TDK

TDK AI PART 615-05-133 Koganei DA 20*25-3001W for TDK

Parts & Supplies | SMT Equipment

AI PART 615-05-133 Koganei DA 20*25-3001W for TDK AI part for TDK: 446-1E-310 cushion spring 562-H-1430 cushion pin 556-G-1910 G main guide 556-E-1860 E sub guide(R) 556-G-1890 G sub guide L unit 556-U-1050 PIN(A) 556-U-1060 PIN(B)

KingFei SMT Tech

TDK TDK 615-05-133 Koganei Cylinder DA 20*25-3001W for AI machine

TDK TDK 615-05-133 Koganei Cylinder DA 20*25-3001W for AI machine

Parts & Supplies | SMT Equipment

AI part for TDK: 446-1E-310 cushion spring 562-H-1430 cushion pin 556-G-1910 G main guide 556-E-1860 E sub guide(R) 556-G-1890 G sub guide L unit 556-U-1050 PIN(A) 556-U-1060 PIN(B) 556-U-1070 PIN(C) 602-30-001 E Ring 446-05-006 S

KingFei SMT Tech

Technical Library: 20-25 (39)

Advanced Packaging Technology

Technical Library | 2019-10-16 10:20:25.0

A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.

ACI Technologies, Inc.

Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance

Technical Library | 2019-08-14 22:20:55.0

Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.

KYZEN Corporation

Express Newsletter: 20-25 (5)

Partner Websites: 20-25 (6629)

PCB Libraries Forum Events - March 2006

PCB Libraries, Inc. |

> 19 20 21 22 23 24 25 > 26 27 28 March 2006 Sunday 19 Monday 20 Tuesday 21 Wednesday 22 Thursday 23 Friday 24 Saturday 25 March 2006   S M T W T F S > 1 2 3 4 > 5 6 7 8 9 10 11

PCB Libraries, Inc.

Heller Reflow Oven Specs

Heller Industries Inc. |

(3 Phase) Standard 480 volts 480 volts Breaker Size 100 amps @ 480v 100 amps @ 480v kW 8.5 - 10.5 Continuous* 8.5 - 10.5 Continuous* Typical Run Current 20 - 25 amps

Heller Industries Inc.

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