New SMT Equipment: 20-25 2005 (3)

emerson drive

emerson drive

New Equipment | Components

Emerson Emerson Emerson Emerson 6180-4503 DSI KEYPAD 996-87 ES200RG CTRL BD 6180-4507 AC INTERFACE BD A916-1232A-H ES150 DC DRIVE 6180-4511 DSI PG AS250 3/4HP ADJ FREQ AC DRIVE 6180-6101 KEYPAD AS255 1HP ADJ FREQ AC DRIVE 6180-6143 KEYPAD GLASS

zhengzhou yuzhe electronic technology co.,ltd

ABB ADVANT CONTROLLER 07KT94 GJR5252100R3261

ABB ADVANT CONTROLLER 07KT94 GJR5252100R3261

New Equipment | Industrial Automation

ABB ADVANT CONTROLLER 07KT94 GJR5252100R3261  CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791   ADVANTAGES: SCHNEIDER 140CPU43412U,140CPU65150,140CPU65160,140CPU65

Moore Automation

Electronics Forum: 20-25 2005 (5)

smt zener color codes

Electronics Forum | Wed Jun 22 14:20:25 EDT 2005 | mmjm_1099

http://www.crystalradio.net/cal/diodeid.shtml

PCB cosmetic reject after reflow

Electronics Forum | Mon Aug 08 20:25:39 EDT 2005 | plcc

Hi Davef, I'm suspecting that too! The recipe we are using is the optimum for good soldering results. I'm checking with our supplier on the type of pcb material. Do you know the recommended material for pcb undergoing reflow, under ROsH condition?

Used SMT Equipment: 20-25 2005 (1)

Technical Library: 20-25 2005 (18)

Effect of Cu–Sn intermetallic Compound Reactions on the Kirkendall Void Growth Characteristics in Cu/Sn/Cu Microbumps

Technical Library | 2014-07-02 16:46:09.0

Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems

Nepes Corporation

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2007-03-08 19:31:10.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force.

Henkel Electronic Materials

Express Newsletter: 20-25 2005 (16)

Partner Websites: 20-25 2005 (4724)

Polyglykol AM/20-20

Clariant Cargo & Device Protection | https://www.clariant.com/de/Solutions/Products/2014/11/20/16/28/Polyglykol-AM2020

Polyglykol AM/20-20 Suchen Share Region Kontakt Schliessen Schliessen Suchen If you are searching for Safety Data Sheets, please visit our Document Finder Alle Ergebnisse Schliessen Facebook Twitter

Clariant Cargo & Device Protection

SDS No: 285-25

| https://qualitek.com/wp-content/uploads/2020/05/285-25_SDS.pdf

SDS No: 285-25 SAFETY DATA SHEET Date Issued : 08/13/2003 SDS No : 285-25 Date Revised : 05/27/2020 Revision No : 10 Qualitek® 285-25 Rosin Mildly Activated Flux 1


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