New SMT Equipment: 200-210 (3)

Modicon 140CRP93100 RIO Networking Module

Modicon 140CRP93100 RIO Networking Module

New Equipment | Industrial Automation

SANDY.[MAILTO:UNITY@MVME.CN]    SANDY.[WHATSAPP/SKYPE/MOBILE:+8618020776786]     SANDY.[QUOTE TO YOU WITHIN THE SHORTEST POSSIBLE TIME WITH OUR BEST PRICE]   WARRANTY: UP TO 12 MONTHS SHIPPING: FAST DELIVERY IS AVAILABLE NEW+ORIGINAL+IN STOCK+ONE YE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Triconex  TCM 4353 Tricon TCM 4353 in stock

Triconex TCM 4353 Tricon TCM 4353 in stock

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: 200-210 (7)

reflow / soldering temperature

Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre

use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder

Soldering to hard gold

Electronics Forum | Fri May 24 09:16:36 EDT 2013 | grahamcooper22

you need to reduce your time above liquidus to as low as you can...maybe 10~30 secs to allow the solder to wet to the gold but minimise the amount of gold that is dissolved into the solder joint...try also reducing the peak temp to 200~210 deg C. Thi

Used SMT Equipment: 200-210 (2)

Sanyo X200 / X210 / 4797L

Used SMT Equipment | SMT Equipment

Sanyo X200, 210 Universal 4797A, 4797B x 2, 4797L x 2   For immediate sales     customerst@163.com  

CS Technology

Universal Instruments (3) GSM1, DEK 265GS, BTU VIP70

Universal Instruments (3) GSM1, DEK 265GS, BTU VIP70

Used SMT Equipment | Turnkey Lines

Functional Pre-Owned Complete SMT Assembly Line - Still Operational    (Subject to prior sell, I am listing this on other venues)   Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe

CybrSecurity Corporation

Parts & Supplies: 200-210 (18)

Yamaha KGK-M9267-01X GUIDE YAMAHA Sli

Yamaha KGK-M9267-01X GUIDE YAMAHA Sli

Parts & Supplies | Assembly Accessories

Mounter F4F5HS50HS60 D series Feeder accessories 2X8mm pressure cover improved 00309036-05 Off-the-shelf Sanyo X100X110X200X210 Feeder  accessories 8*2 Feida connecting rod 630 095 8713 SMT placement machine F4F5HS50 HS60 D series Feeder 

KingFei SMT Tech

Samsung J9055004C-COMPLIANCE CP40 nozzle support rod HOLDER original

Samsung J9055004C-COMPLIANCE CP40 nozzle support rod HOLDER original

Parts & Supplies | Pick and Place/Feeders

J9055004C-COMPLIANCE CP40 nozzle support rod HOLDER original J9055004C-COMPLIANCE CP40 nozzle support rod HOLDER original Email:smtdwx@foxmail.com Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 WWW.zghuanan.com DEK printing machine thimble

CNSMT CO.LTD

Technical Library: 200-210 (4)

Effects of Temperature Uniformity on Package Warpage

Technical Library | 2019-10-03 14:27:01.0

Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage.

Akrometrix

Implementing Lead Free Soldering - European Consortium Research

Technical Library | 2007-07-12 14:29:37.0

Over the last ten years, there have been a large number of publications describing work into lead free electronics soldering. They have come from all regions of the world and from academic organisations, individual companies and consortia. Although a number of these studies have culminated in "production trials", these have invariably been on a limited scale and they were essentially a demonstration, rather than the first step to implementation.

Multicore Solders

Partner Websites: 200-210 (404)


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