New SMT Equipment: 2004 2mm (37)

I-PULSE Z-AXIS MOTOR LC1-M71M0-00X P50BA2004DXSL1 FOR M2 M4E MACHINE

I-PULSE Z-AXIS MOTOR LC1-M71M0-00X P50BA2004DXSL1 FOR M2 M4E MACHINE

New Equipment | Components

◆Brand Name:Sony ◆Part NO:LC1-M71M0-00X ◆Model:P50BA2004DXSL1 ◆Place of Origin:China ◆Port:Shenzhen City ◆Delivery:1-5 working days ◆Payment Terms:T/T,Western Union ◆Package:Foam+Carton ◆Specifications: For M2 M4E Machine, Z Axis I-Pulse N

Dafton Electronic Co.,Limited

I-PULSE Z-AXIS MOTOR LC1-M71M1-00X P50BA2004DXS23 FOR M2 M4E MACHINE

I-PULSE Z-AXIS MOTOR LC1-M71M1-00X P50BA2004DXS23 FOR M2 M4E MACHINE

New Equipment | Components

◆Brand Name:Sony ◆Part NO:LC1-M71M1-00X ◆Model:P50BA2004DXS23 ◆Place of Origin:China ◆Port:Shenzhen City ◆Delivery:1-5 working days ◆Payment Terms:T/T,Western Union ◆Package:Foam+Carton ◆Specifications: For M2 M4E Machine,Z-Axis I-Pulse Mo

Dafton Electronic Co.,Limited

Electronics Forum: 2004 2mm (10)

0201's, csp's and mold cap

Electronics Forum | Fri May 14 08:31:07 EDT 2004 | todd_ferrell

We're looking for a contractor who can support high volume production of 0201 passives and 1-2mm csp's to create 4mm sq. RF modules as well as mold cap capabilities. Any leads would appreciated.

Thick lead

Electronics Forum | Mon Jul 12 23:57:40 EDT 2004 | haran

Does anyone have experience cutting lead for PTH component with the thickness of around 2 mm.?Any supplier that I can talk?Please advise.

Used SMT Equipment: 2004 2mm (6)

Samsung CP45FV NEO feeders 8*2

Used SMT Equipment | Pick and Place/Feeders

Hello Friends, We have below Samsung feeders to sell, if you need, please kindly contact us. Samsung CP45FV NEO 8*2MM feeder: 100pcs Best regards, Julie Fun purchasing@taijiedz.com.cn TaJee Electronic Equipment Ltd

TaJee Electronics Equipment Ltd

Samsung CP Series Feeders

Samsung CP Series Feeders

Used SMT Equipment | Pick and Place/Feeders

Samsung CP Series Feeders in Stock at IBE: 18  of  Samsung CP Series, Embossed, 8x2mm, 13in Pan, P/N NA-2mm 88  of  Samsung CP Series, Paper, 8x2mm, 7in Pan, P/N NA-2mm 96  of  Samsung CP Series, Paper, 8x2mm, 7in Pan, P/N NB 2  of  Samsung CP S

IBE SMT Equipment

Industry News: 2004 2mm (5)

Parvus to Offer CompactFlash IDE Adapter for Embedded Computers, Supporting Both Type I and Type II Cards with 40 or 44-Pin IDE Connections

Industry News | 2004-08-16 11:54:31.0

Low-cost CFII-IDE adapter provides panel-mountable solution for solid-state CompactFlash and IBM� Microdrive� media

Parvus Corporation

Feeder Finger Celebrates 15 Years of Reducing Costs & Improving Efficiency

Industry News | 2019-01-22 12:20:29.0

Feeder Finger is pleased to announce the company’s 15-year anniversary. Based in San Diego, CA, ATS was founded in 2001 with the launch of the Standard Pro 2mm Pitch Feeders for the Quad/Tyco platform and incorporated in 2004.

Feeder Finger

Parts & Supplies: 2004 2mm (25)

I-Pulse  M1 Z MOTOR P50BA2004DXS23 40W

I-Pulse M1 Z MOTOR P50BA2004DXS23 40W

Parts & Supplies | Assembly Accessories

I-PULSE M1 Z DDRIVER PY2A015A2 I-PULSE M1 Z MOTOR P50BA2004DXS23 I-PULSE feeder : PS 8*2MM I-PULSE feeder : PS 8*4MM I-PULSE feeder : PS 12MM I-PULSE feeder : PS 16MM I-PULSE feeder : PS 24MM I-PULSE feeder : PS 32MM I-PULSE feeder : PS 44

KingFei SMT Tech

Juki SMT Juki CFR 8X4mm Big Tail Feeder in Stock

Juki SMT Juki CFR 8X4mm Big Tail Feeder in Stock

Parts & Supplies | Assembly Accessories

Juki feeder in stock JUKI CF 8X2MM JUKI CF 8X4MM JUKI CFR 8X2MM JUKI CFR 8X4MM JUKI AF 8X2MM JUKI AF 8X4MM JUKI FF 12MM JUKI FF 16MM JUKI FF 24MM JUKI FF 32MM JUKI FF 44MM JUKI FF 56MM FEEDER MODLE JUKI MACHINE MODLE JUKI ATF CTF FTF 8*

KingFei SMT Tech

Technical Library: 2004 2mm (19)

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Improvement of Organic Packaging Thermal Cycle Performance Measurement

Technical Library | 2006-11-01 22:37:23.0

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation.

IBM Corporation

Express Newsletter: 2004 2mm (23)

SMT Express, Volume VI, Issue No. 2 - from SMTnet.com

SMT Express, Volume VI, Issue No. 2 - from SMTnet.com   The Answers are at NEPCON East / Electro EXHIBITION: MAY 5-6, 2004CONFERENCE: MAY 4-6, 2004The Hynes Convention Center - Boston, MA Register Now For FREE Show Admission NEPCON East

SMT Express, Volume VI, Issue No. 3 - from SMTnet.com

SMT Express, Volume VI, Issue No. 3 - from SMTnet.com   Visit ATExpo and see the latest products and technologies for the entire assembly process. EXHIBITION: September 28-30, 2004CONFERENCE: September 27-30, 2004Donald E. Stephiens

Partner Websites: 2004 2mm (6)

PQFN Pad Size - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pqfn-pad-size_topic2253_post9319.html

.  IPC-7351 which was created in 2003 - 2004 is 14 years old and many things have improved in the electronics industry and IPC-7351 has not kept up with the latest technology

PCB Libraries, Inc.

Heller Oven Software Versions for HC1 controller PN:686047

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/686047-Win98SE-Software-versions-HC1-controller.pdf

distance entry box. (default 2cm, range 0.5 to 3cm ) 3. selection for rail final position direction: “Hunt as HomeIn” or “Hunt as HomeOut” 4. Maximum Hunt Try entry box. (0 to 5) 5. add – and + tolerance entry box. (+ 0 to 2mm, - 0 to 2mm, tolerance band

Heller Industries Inc.


2004 2mm searches for Companies, Equipment, Machines, Suppliers & Information

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