◆Brand Name:Sony ◆Part NO:LC1-M71M0-00X ◆Model:P50BA2004DXSL1 ◆Place of Origin:China ◆Port:Shenzhen City ◆Delivery:1-5 working days ◆Payment Terms:T/T,Western Union ◆Package:Foam+Carton ◆Specifications: For M2 M4E Machine, Z Axis I-Pulse N
◆Brand Name:Sony ◆Part NO:LC1-M71M1-00X ◆Model:P50BA2004DXS23 ◆Place of Origin:China ◆Port:Shenzhen City ◆Delivery:1-5 working days ◆Payment Terms:T/T,Western Union ◆Package:Foam+Carton ◆Specifications: For M2 M4E Machine,Z-Axis I-Pulse Mo
Hello Friends, We have below Samsung feeders to sell, if you need, please kindly contact us. Samsung CP45FV NEO 8*2MM feeder: 100pcs Best regards, Julie Fun email@example.com TaJee Electronic Equipment Ltd
Samsung CP Series Feeders in Stock at IBE: 18 of Samsung CP Series, Embossed, 8x2mm, 13in Pan, P/N NA-2mm 88 of Samsung CP Series, Paper, 8x2mm, 7in Pan, P/N NA-2mm 96 of Samsung CP Series, Paper, 8x2mm, 7in Pan, P/N NB 2 of Samsung CP S
Industry News | 2004-08-16 11:54:31.0
Low-cost CFII-IDE adapter provides panel-mountable solution for solid-state CompactFlash and IBM� Microdrive� media
Industry News | 2019-01-22 12:20:29.0
Feeder Finger is pleased to announce the company’s 15-year anniversary. Based in San Diego, CA, ATS was founded in 2001 with the launch of the Standard Pro 2mm Pitch Feeders for the Quad/Tyco platform and incorporated in 2004.
I-PULSE M1 Z DDRIVER PY2A015A2 I-PULSE M1 Z MOTOR P50BA2004DXS23 I-PULSE feeder : PS 8*2MM I-PULSE feeder : PS 8*4MM I-PULSE feeder : PS 12MM I-PULSE feeder : PS 16MM I-PULSE feeder : PS 24MM I-PULSE feeder : PS 32MM I-PULSE feeder : PS 44
Juki feeder in stock JUKI CF 8X2MM JUKI CF 8X4MM JUKI CFR 8X2MM JUKI CFR 8X4MM JUKI AF 8X2MM JUKI AF 8X4MM JUKI FF 12MM JUKI FF 16MM JUKI FF 24MM JUKI FF 32MM JUKI FF 44MM JUKI FF 56MM FEEDER MODLE JUKI MACHINE MODLE JUKI ATF CTF FTF 8*
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2006-11-01 22:37:23.0
Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation.
SMT Express, Volume VI, Issue No. 2 - from SMTnet.com The Answers are at NEPCON East / Electro EXHIBITION: MAY 5-6, 2004CONFERENCE: MAY 4-6, 2004The Hynes Convention Center - Boston, MA Register Now For FREE Show Admission NEPCON East
SMT Express, Volume VI, Issue No. 3 - from SMTnet.com Visit ATExpo and see the latest products and technologies for the entire assembly process. EXHIBITION: September 28-30, 2004CONFERENCE: September 27-30, 2004Donald E. Stephiens
. IPC-7351 which was created in 2003 - 2004 is 14 years old and many things have improved in the electronics industry and IPC-7351 has not kept up with the latest technology
distance entry box. (default 2cm, range 0.5 to 3cm ) 3. selection for rail final position direction: “Hunt as HomeIn” or “Hunt as HomeOut” 4. Maximum Hunt Try entry box. (0 to 5) 5. add – and + tolerance entry box. (+ 0 to 2mm, - 0 to 2mm, tolerance band