Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef
There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust
Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette
Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w
Electronics Forum | Tue Jul 20 02:36:03 EDT 2004 | yukim
Hi, The solder paste is SE5-M951X-9. Comparing with the previous one we used, we are having much more tombstoning problems. The reflow profile is such as: room temp to 140C: 85~95 sec 140 to 170 C: 80 sec 170 to 200 C: 20 ~ 23 sec Above 200 C: 44 ~
Electronics Forum | Thu Jun 19 12:40:09 EDT 2008 | realchunks
If I read this right, it says 50 seconds or less above 200C. It doesn't say you cannot go above 200 C. Right? if so we do it all the time. We have some Quality gurus here that always blame our ovens for everything form a didle-I-Joe to a Dam-If-I
Electronics Forum | Tue Mar 24 22:03:39 EDT 2015 | davef
Here's some notes from IPC APEX 2015: * Black underfill is Heraeus. It needs to be preheated to 180-200*C for rework. Above 200*C it changes state and becomes difficult. * Clear underfill is from an unknown Korean supplier. * People from Heraeus w
Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite
Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process
Electronics Forum | Tue May 22 18:13:44 EDT 2007 | Frank
No, we haven't compared bills because we rarely let it cool completely down over night. I would think that the cost needed maintaining 200C over night versus 310C over night would be about the same, but a little less. But going from 25C up to 3
Electronics Forum | Wed Sep 29 02:40:45 EDT 1999 | Robert
Hi All, Any one experince BGA-chipset warp about 10-15mil after removing from PCB? FYI, the rework temperature for preheat was 170C from room temperature about 30 seconds, & BGA was removed at temperature between 190-200C. Thankyou. BRs, Robert
Electronics Forum | Sun Nov 11 07:38:56 EST 2001 | hany_khoga
Mr Davef: Thanks Dave, but what is your opinion about what fmonette hase sent, telling me that I will never reach 200^C on top side (In wave soldering) which is the danger threshold according to the JEDEC recommendations.
Electronics Forum | Wed Jun 27 10:44:09 EDT 2007 | bjrap3
What would a good ramp rate be. I am running from 205-217C in 17 seconds. My reflow is 217-235 for 68 seconds. The bottom preheaters are set at 200C and the nozzle is 2075 & 295 for each process respectively.
